Integrated circuit inductors

• US 6,850,141 B2
• Filed: 03/18/2002
• Issued: 02/01/2005
• Est. Priority Date: 07/09/1999
• Status: Expired due to Term

• Current Assignee: Micron Technology, Inc.
• Original Assignee: Micron Technology, Inc.
• Inventors: Ahn, Kie Y., Forbes, Leonard
• Primary Examiner(s): Nguyen, Viet Q.
• Application Number:
  US10/101,403
• Publication Number:
  US 20020095775A1
• Time in Patent Office: 1,051 Days
• Field of Search: 336/173, 336/186, 336/83, 336/84, 336/98, 336/147, 296/04, 296/05
• US Class Current: 336/173
• CPC Class Codes: H01F 17/0033 with the coil helically wound around a magnetic core
• CPC Class Codes: H01F 27/2804 Printed windings
• CPC Class Codes: H01F 37/00 Fixed inductances not covered by group H01F17/00
• CPC Class Codes: H01L 27/08 including only semiconductor components of a single kind
• CPC Class Codes: Y10S 257/924 with passive device, e.g. capacitor, or battery, as integral part of housing or housing element, e.g. cap
• CPC Class Codes: Y10T 29/4902 Electromagnet, transformer or inductor
• CPC Class Codes: Y10T 29/49037 Using reference point/surface to facilitate measuring
• CPC Class Codes: Y10T 29/49069 Data storage inductor or core
• CPC Class Codes: Y10T 29/49071 by winding or coiling
• CPC Class Codes: Y10T 29/49073 by assembling coil and core
• CPC Class Codes: Y10T 29/49075 including permanent magnet or core

Abstract

The invention relates to an inductor comprising a plurality of interconnected conductive segments interwoven with a substrate. The inductance of the inductor is increased through the use of coatings and films of ferromagnetic materials such as magnetic metals, alloys, and oxides. The inductor is compatible with integrated circuit manufacturing techniques and eliminates the need in many systems and circuits for large off chip inductors. A sense and measurement coil, which is fabricated on the same substrate as the inductor, provides the capability to measure the magnetic field or flux produced by the inductor. This on chip measurement capability supplies information that permits circuit engineers to design and fabricate on chip inductors to very tight tolerances.

Claims

1. An inductor comprising:

a substrate;

a pair of substantially parallel rows of conductive columns providing a conductive path through the substrate; and

a plurality of conductive segments interconnecting the pair of substantially parallel rows of conductive columns to form a coil.

2. The inductor of claim 1, wherein the substrate has a plurality of substantially planarized surfaces.

3. The inductor of claim 1, wherein the columns are substantially perpendicular to at least two of the substantially planarized surfaces.

4. The inductor of claim 3, wherein a test coil is fabricated on one of the substantially planarized surfaces.

5. The inductor of claim 4, wherein the test coil is a spiral coil.

6. An inductor comprising:

a substrate;

a ferromagnetic layer in contact with the substrate; and

a highly conductive path interwoven with the substrate, said highly conductive path defined by a pair of substantially parallel rows of conductive columns passing through the substrate and a plurality of conductive segments interconnecting the pair of substantially parallel rows of conductive columns.

7. The inductor of claim 6, wherein the substrate is a semiconductor.

8. The inductor of claim 6, further comprising an insulating layer and a magnetic material layer formed on the substrate between the highly conductive path and the substrate.

9. The inductor of claim 8, wherein the insulating layer is a dielectric.

10. The inductor of claim 6, wherein the highly conductive path is in the shape of a coil.

11. The inductor of claim 10, wherein the coil comprises rectangular loops.

12. The inductor of claim 11, wherein the coil comprises square loops.

13. An inductor comprising:

a substrate having a magnetic film formed on a first surface of the substrate;

a pair of substantially parallel rows of conductive columns providing a conductive path through the substrate; and

a plurality of conductive segments interconnecting the pair of substantially parallel rows of conductive columns to form a coil that least partially surrounds the magnetic film.

14. The inductor of claim 13, wherein the magnetic film comprises a magnetic oxide.

15. The inductor of claim 14, wherein the magnetic film comprises magnetic gamma oxide.

16. The inductor of claim 14, wherein the magnetic film comprises high-coercivity gamma iron oxide.

17. The inductor of claim 13, wherein the magnetic film is a nickel-iron alloy.

18. The inductor of claim 13 further including a second magnetic film formed on a second surface of the substrate.

19. The inductor of claim 18, wherein the first and second magnetic films are formed from the same material.

20. An inductor comprising:

a substrate;

a highly conductive path formed from at least one metal conductor, said highly conductive path comprising;

a pair of substantially parallel rows of columns passing through the substrate; and

a plurality of segments interconnecting the pair of substantially parallel rows of conductive columns.

21. The inductor of claim 20, wherein the highly conductive path forms a coil.

22. The inductor of claim 20, wherein the at least one metal conductor includes a conductor selected from the group consisting of:

aluminum, copper and gold.

23. The inductor of claim 20, wherein the at least one metal conductor at least partially surrounds a magnetic film formed on the substrate.

24. The inductor of claim 23, wherein the magnetic film is surrounded by at least one insulating layer.

25. The inductor of claim 20, wherein the at least one metal conductor comprises two different metals.

26. An inductor comprising:

a substrate;

a magnetic material layer formed atop a surface of the substrate;

an insulating layer formed atop the magnetic material layer;

a pair of substantially parallel rows of conductive columns providing a conductive path through the substrate; and

a plurality of conductive segments interconnecting the pair of substantially parallel rows of conductive columns to form a coil that least partially surrounds the magnetic material layer.

27. The inductor of claim 26, wherein the magnetic material layer comprises a magnetic oxide.

28. The inductor of claim 26, wherein the insulating layer comprises polyimide.

29. The inductor of claim 26, wherein the insulating layer comprises an inorganic oxide.

30. An inductor comprising:

a substrate having first and second opposite surfaces;

a first magnet material layer formed on the first surface;

a second magnetic material layer formed on the second surface;

a pair of substantially parallel rows of conductive columns providing a conductive path through the substrate; and

a plurality of conductive segments interconnecting the pair of substantially parallel rows of conductive columns to form a coil that least partially surrounds the first and second magnetic material layers.

31. The inductor of claim 30, further including:

a first insulating layer surrounding the first magnetic material layer; and

a second insulating layer surrounding the second magnetic material layer.

32. The inductor of claim 31, wherein the first and second magnetic material layers are formed from the same magnetic material.

33. An inductor comprising:

a semiconductor substrate having a rectangular cross-section;

a pair of substantially parallel rows of conductive columns providing a conductive path through the substrate; and

a plurality of conductive segments interconnecting the pair of substantially parallel rows of conductive columns to form a coil.

34. The inductor of claim 33, further including first and second layers of magnetic material formed atop opposing parallel surfaces of the substrate and at least partially encompassed by the plurality of conductive segments.

35. The inductor of claim 34, further including first and second layers of insulating material covering the first and second layers of magnetic material, respectively.