Management system for automated wire bonding process
First Claim
1. An integrated management system structured to automatically execute a procedure of reviewing and editing an assembly reference and a bonding specification used for manufacturing IC packages, said system comprising:
- a drawing management system structured to output the assembly reference including a bonding diagram, a package outline, a package pin configuration, and package pin coordinates;
a bonding specification drawing system structured to output, based on the assembly reference, the bonding specification including a chip size of a chip, an electrode pad size for each electrode pad on the chip, an electrode pad position of the each electrode pad, a die pad size of each die pad, a die pad position of the each die pad, a length of each bonding wire, a position and an angle of the each bonding wire, a bonding sequence, a datum point for the each electrode pad, a datum point of each lead, a central point for the electrode pad, and a bonding attach point of the lead;
a database server structured to store and manage the assembly reference and the bonding specification;
a file server structured to manage an information diagram for a standard component, the package outline, the bonding diagram, and a formatted output file; and
a web server structured to provide a web interface to a user seeking to establish a remote access with the drawing management system, wherein the drawing management system comprises a bonding rule check module structured to verify whether the bonding specification meets a bonding rule suitable for an automated wire bonding process, and wherein the drawing management system is structured to transmit the formatted output file to a bonding apparatus.
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Abstract
An integrated management system is provided for automatically executing a procedure of reviewing and editing an assembly reference and a bonding specification used for manufacturing IC packages. The system includes a drawing management system (DMS) that creates the assembly reference, and a bonding specification drawing system that creates, based on the assembly reference, the bonding specification. The integrated management system further includes a DMS database server that stores and manages the assembly reference and the bonding specification, a DMS file server that manages a blank diagram, a package outline, a bonding diagram, and a standard file, and a DMS web server that provides a web interface to a user for permitting a remote access. In particular, the drawing management system has a bonding rule check module that verifies whether the bonding specification meets a bonding rule suitable for an automated wire bonding process. The drawing management system produces the standard file to be transmitted to bonding equipments.
70 Citations
31 Claims
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1. An integrated management system structured to automatically execute a procedure of reviewing and editing an assembly reference and a bonding specification used for manufacturing IC packages, said system comprising:
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a drawing management system structured to output the assembly reference including a bonding diagram, a package outline, a package pin configuration, and package pin coordinates;
a bonding specification drawing system structured to output, based on the assembly reference, the bonding specification including a chip size of a chip, an electrode pad size for each electrode pad on the chip, an electrode pad position of the each electrode pad, a die pad size of each die pad, a die pad position of the each die pad, a length of each bonding wire, a position and an angle of the each bonding wire, a bonding sequence, a datum point for the each electrode pad, a datum point of each lead, a central point for the electrode pad, and a bonding attach point of the lead;
a database server structured to store and manage the assembly reference and the bonding specification;
a file server structured to manage an information diagram for a standard component, the package outline, the bonding diagram, and a formatted output file; and
a web server structured to provide a web interface to a user seeking to establish a remote access with the drawing management system, wherein the drawing management system comprises a bonding rule check module structured to verify whether the bonding specification meets a bonding rule suitable for an automated wire bonding process, and wherein the drawing management system is structured to transmit the formatted output file to a bonding apparatus. - View Dependent Claims (2, 3, 4, 5, 6, 7, 8, 9, 10, 11, 12, 13, 14, 15, 16, 17, 18, 19, 20, 21, 22, 23, 24, 25, 26, 27, 28, 29, 30)
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31. A method of automatically executing a procedure of reviewing and editing an assembly reference and a bonding specification based on the assembly reference, wherein the assembly reference and the bonding specification are used for manufacturing IC packages, said method comprising:
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producing the assembly reference with a drawing management system, the assembly reference comprising a bonding diagram, a package outline, a package pin configuration, and package pin coordinates, wherein producing the assembly reference further comprises verifying whether the bonding specification meets a bonding rule suitable for an automated wire bonding process using a bonding rule check module;
producing the bonding specification with a bonding specification drawing system, the bonding specification comprising a chip size of a chip, an electrode pad size for at least two electrode pads on the chip, an electrode pad position of the at least two electrode pads, a die pad size of a die pad of the chip, a die pad position of each die pad, a length of each bonding wire, a position and an angle of each bonding wire, a bonding sequence, a datum point for each of the at least two electrode pads, a datum point of a lead, a central point for each of the at least two electrode pads, and a bonding attach point of the lead;
storing and managing the assembly reference and the bonding specification with a database server;
managing an information diagram for a standard component, the package outline, the bonding diagram, and a formatted output file with a file server;
establishing a connection between the drawing management system and a remote user with a web browser interface; and
transmitting the formatted output file to a bonding apparatus.
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Specification