Method of trimming a gate electrode structure
First Claim
1. A method of trimming a gate electrode structure, the method comprising:
- providing a gate electrode structure having a first dimension;
selecting a trimming recipe;
forming a reaction layer through reaction with the gate electrode structure; and
selectively removing the reaction layer from the unreacted portion of the gate electrode structure by chemical etching, thereby forming a trimmed gate electrode structure having a second dimension that is smaller than the first dimension.
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Abstract
A method and processing tool are provided for trimming a gate electrode structure containing a gate electrode layer with a first dimension. A reaction layer is formed through reaction with the gate electrode structure. The reaction layer is the selectively removed from the unreacted portion of the gate electrode structure by chemical etching, thereby forming a trimmed gate electrode structure with a second dimension that is smaller than the first dimension. The trimming process can be carried out under process conditions where formation of the reaction layer is substantially self-limiting. The trimming process can be repeated to further reduce the dimension of the gate electrode structure.
126 Citations
34 Claims
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1. A method of trimming a gate electrode structure, the method comprising:
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providing a gate electrode structure having a first dimension;
selecting a trimming recipe;
forming a reaction layer through reaction with the gate electrode structure; and
selectively removing the reaction layer from the unreacted portion of the gate electrode structure by chemical etching, thereby forming a trimmed gate electrode structure having a second dimension that is smaller than the first dimension. - View Dependent Claims (2, 3, 4, 5, 6, 7, 8, 9, 10, 11, 12, 13, 14, 15, 16, 17, 18, 19, 20, 21, 22, 23, 24, 25, 26, 27)
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28. A processing tool, comprising:
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a substrate loading chamber configured for loading and unloading a substrate with a gate electrode structure having a first dimension;
a transfer system configured for transferring the substrate within the processing tool;
at least one processing system configured for forming a reaction layer through reaction with the gate electrode structure and selectively removing the reaction layer from the unreacted portion of the gate electrode structure by chemical etching; and
a controller configured for controlling the processing tool according to a trimming recipe to form a gate electrode structure having a second dimension that is smaller than the first dimension. - View Dependent Claims (29, 30, 31, 32, 33, 34)
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Specification