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Packaged die on PCB with heat sink encapsulant and methods

  • US 6,853,069 B2
  • Filed: 08/12/2003
  • Issued: 02/08/2005
  • Est. Priority Date: 05/24/1996
  • Status: Expired due to Fees
First Claim
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1. A semiconductor assembly comprising:

  • a substrate;

    a semiconductor chip having a first surface and a second surface, at least a portion of the first surface attached to a portion of the substrate and electrically connected to a portion of the substrate;

    a barrier material adhered to a periphery of the second surface of the semiconductor chip substantially forming a wall, the barrier material substantially contacting a portion of the substrate, the barrier material having a first thermal conductivity;

    a recess defined by the wall about the periphery of the second surface of the semiconductor chip; and

    a heat-dissipating material disposed within the recess, the heat-dissipating material having a second thermal conductivity different than the first thermal conductivity of the barrier material.

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