Wireless GPS apparatus with integral antenna device

• US 6,853,338 B2
• Filed: 04/11/2003
• Issued: 02/08/2005
• Est. Priority Date: 06/30/2000
• Status: Expired due to Term

• Current Assignee: CSR Technology Incorporated (Qualcomm, Inc.)
• Original Assignee: SIRF Technology Incorporated (Qualcomm, Inc.)
• Inventors: McConnell, Richard J.
• Primary Examiner(s): CHEN, SHIH CHAO
• Application Number:
  US10/412,146
• Publication Number:
  US 20030210200A1
• Time in Patent Office: 669 Days
• Field of Search: 343/702, 343/700.MS, 343/829, 343/845, 343/846, 343/848, 343/841, 343/895, 343/793
• US Class Current: 343/702
• CPC Class Codes: H01Q 1/243 with built-in antennas
• CPC Class Codes: H01Q 1/38 formed by a conductive layer on an insulating support patch antennas H01Q9/0407; microstrip dipole antennas H01Q9/065; microstrip slot antennas H01Q13/106; transmission line microstrip antennas H01Q13/206; manufacturing reflecting surfaces using insulating material for supporting the reflecting surface H01Q15/142

Abstract

A wireless apparatus includes an electrically conductive casing housing a ground plane and GPS receiver circuitry. The casing is electrically connected to the ground plane to form a first antenna element. The apparatus further includes a second antenna element located external the casing. The second antenna element may be configured as a wire filament in the form of a copper trace carried by a printed circuit board. The second antenna element is electrically coupled to the first antenna element and the GPS receiver circuitry. The first antenna element and second antenna element are configured and disposed relative to each other to form an antenna for receiving GPS signals.

Claims

1. A wireless communication apparatus, comprising:

an encased portion comprising,

global positioning system (“

GPS”

) receiver circuit; and

a first integrated antenna element coupled to the GPS receiver circuit, wherein the first integrated antenna element comprises,

a casing that at lesat partially encloses the encased portion, and

a ground plane coupled to the casing and to the GPS receiver circuit; and

at least one additional integrated antenna element coupled to the first integrated antenna element to receive GPS signals.

2. The wireless communication apparatus of claim 1, wherein the GPS receiver circuit and the ground plane comprise are implemented on a printed circuit board.

3. The wireless communication apparatus of claim 1, wherein the at least one additional integrated antenna element comprises a conductive filament external to the casing.

4. The wireless communication apparatus of claim 2, wherein the at least one additional integrated antenna comprises a trace on the printed circuit board.

5. The wireless communication apparatus of claim 1, wherein the at least one additional integrated antenna is conductively coupled to the GPS receiver circuit via a signal port.

6. The wireless communication apparatus of claim 1, wherein the at least one additional integrated antenna is conductively coupled to the first integrated antenna and to the GPS receiver circuit via an inductive element.

7. The wireless communication apparatus of claim 6, wherein the inductive element is conductively coupled to the casing at a first connection point and to the at least one additional integrated antenna at a second connection point.

8. The wireless communication apparatus of claim 7, wherein a location of at least one of the first connection point and the second connection point is adjustable for matching to optimize signal transfer to the GPS receiver.

9. The wireless communication apparatus of claim 7, wherein the second connection point is further conductively coupled to the GPS receiver via a signal port.

10. The wireless communication apparatus of claim 1, wherein the first integrated antenna and the at least one additional integrated antenna form a dipole antenna.

11. The wireless communication apparatus of claim 1, wherein the first integrated antenna and the at least one additional integrated antenna form a large parallel inductor-capacitor resonator.

12. The wireless communication apparatus of claim 1, wherein the first integrated antenna element further comprises at least one radiation shield coupled to the casing.

13. An integrated antenna arrangement for a wireless device, comprising:

a first antenna element implemented integrally with signal receiving circuitry of the wireless device, wherein the signal receiving circuitry comprises a global positioning system (“

GPS”

) receiver circuit, wherein the first antenna element is at least partially encased in an encased portion of the wireless device, wherein the first antenna element comprises;

a casing that at least partially encloses the encased portion; and

a ground plane coupled to the casing and to the GPS receiver circuit, wherein the intearated antenna arrangement is coupled to the GPS receiver circuit; and

at least one additional antenna element coupled to the first antenna element within the wireless device, wherein the first antenna element and the at least one additional antenna element are configurable to receive signals for the signal receiving circuitry regardless of a position of the wireless device relative to a source of the received signals.

14. The integrated antenna arrangement of claim 13, wherein the GPS circuitry and the ground plane comprise are implemented on a printed circuit board.

15. The integrated antenna arrangement of claim 13, wherein the at least one additional integrated antenna element comprises a conductive filament external to the casing.

16. The integrated antenna arrangement of claim 14, wherein the at least one additional integrated antenna comprised a trace on the printed circuit board.

17. The integrated antenna arrangement of claim 13, wherein the at least one additional integrated antenna is conductively coupled to the GPS receiver circuit via a signal port.

18. The integrated antenna arrangement of claim 13, wherein the at least one additional integrated antenna is conductively coupled to the first integrated antenna and to the GPS receiver circuit via an inductive element.

19. The integrated antenna arrangement of claim 18, wherein the inductive element is conductively coupled to the casing at a first connection point and to the at least one additional integrated antenna at a second connection point.

20. The wireless communication apparatus of claim 19, wherein a location of at least one of the first connection point and the second connection point is adjustable for matching to optimize signal transfer to the GPS receiver.

21. The wireless communication apparatus of claim 19, wherein the second connection point is further conductively coupled to the GPS receiver via a signal port.

22. The wireless communication apparatus of claim 13, wherein the first integrated antenna and the at least one additional integrated antenna form a dipole antenna.

23. The wireless communication apparatus of claim 13, wherein the first integrated antenna and the at least one additional integrated antenna form a large parallel inductor-capacitor resonator.

24. The wireless communication apparatus of claim 13, wherein the first antenna element further comprises at least one radiation shield coupled to the casing.

25. A method for fabricating a wireless communication device, the method comprising:

forming an encased portion, wherein the encased portion comprises a casing that at least partially encloses a signal receiving circuit and a first integrated antenna element;

forming at least one additional integrated antenna element that is external to the encased portion an internal to the wireless communication device, wherein the first antenna element and the at least one additional antenna element are configurable to receive signals for the signal receiving circuitry regardless of a position of the wireless device relative to a source of the received signals.