Probe card with coplanar daughter card
First Claim
1. A probe card assembly for electrically communicating test data between a semiconductor test apparatus and a semiconductor device under test, said probe card assembly comprising:
- a substrate configured to electrically contact said semiconductor tester apparatus, a plurality of probes configured to electrically contact said semiconductor device under test, said plurality of probes located to a first side of said substrate, a daughter card located to a second side of said substrate, and an electric circuit at least a portion of which is disposed on said daughter card, wherein said electric circuit receives as input test data received at said probe card assembly from one of said tester apparatus or said semiconductor device under test, enhances said test data, and outputs enhanced test data.
2 Assignments
0 Petitions
Accused Products
Abstract
A probe card assembly includes a printed circuit board with tester contacts for making electrical connections to a semiconductor tester. The probe card assembly also includes a probe head assembly with probes for contacting a semiconductor device under test. One or more daughter cards is mounted to the printed circuit board such that they are substantially coplanar with the printed circuit board. The daughter cards may contain a circuit for processing test data, including test signals to be input into the semiconductor and/or response signals generated by the semiconductor device in response to the test signals.
-
Citations
55 Claims
-
1. A probe card assembly for electrically communicating test data between a semiconductor test apparatus and a semiconductor device under test, said probe card assembly comprising:
-
a substrate configured to electrically contact said semiconductor tester apparatus, a plurality of probes configured to electrically contact said semiconductor device under test, said plurality of probes located to a first side of said substrate, a daughter card located to a second side of said substrate, and an electric circuit at least a portion of which is disposed on said daughter card, wherein said electric circuit receives as input test data received at said probe card assembly from one of said tester apparatus or said semiconductor device under test, enhances said test data, and outputs enhanced test data. - View Dependent Claims (2, 3, 4, 5, 6, 7, 8, 9, 10, 11, 12, 13, 14, 15, 16, 17)
-
-
18. A method of making a probe card assembly, said method comprising:
-
providing a substrate including a plurality of tester contacts, disposing a plurality of probes to a first side of said substrate, said probes configured to electrically contact a semiconductor device under test, and disposing a daughter card to a second side of said substrate, providing an electric circuit that receives as input test data received at said probe card assembly from one of said tester apparatus or said semiconductor device under test, enhances said test data, and outputs enhanced test data, and disposing at least a portion of said electric circuit on said daughter card. - View Dependent Claims (19, 20, 21, 22, 23, 24, 25, 26, 27, 28, 29, 30, 31, 32, 33, 34, 35, 36, 37, 38)
-
-
39. A probe card assembly comprising:
-
printed circuit means for electrically communicating with a semiconductor tester apparatus, contact means for electrically communicating with a semiconductor device under test, said contact means being secured to a first surface of said printed circuit means, electric circuit means for enhancing test data receive at said probe card assembly from one of said semiconductor tester apparatus or said semiconductor device under test, and daughter card means for physically supporting at least a portion of said electric circuit means, said daughter card means secured to a second surface of said printed circuit means. - View Dependent Claims (40, 41, 42, 43, 44, 45, 46)
-
-
47. A probe card assembly for electrically communicating test data between a semiconductor test apparatus and a semiconductor device under test, said probe card assembly comprising:
-
a printed circuit board configured to electrically contact said semiconductor tester apparatus, a plurality of probes configured to electrically contact said semiconductor device, a daughter card secured to said printed circuit board, and an electric circuit configured receive as input test data received at said probe card assembly from one of said tester apparatus or said semiconductor device under test, enhance said test data, and output enhanced test data, at least a portion of said electric circuit being disposed on said daughter card. - View Dependent Claims (48, 49, 50, 51, 52, 53, 54, 55)
-
Specification