Integrated inductor

• US 6,856,228 B2
• Filed: 01/19/2001
• Issued: 02/15/2005
• Est. Priority Date: 11/23/1999
• Status: Expired due to Term

• Current Assignee: Intel Corporation
• Original Assignee: Intel Corporation
• Inventors: Gardner, Donald S.
• Primary Examiner(s): Nguyen, Tuyen T.
• Application Number:
  US09/766,162
• Publication Number:
  US 20010030591A1
• Time in Patent Office: 1,488 Days
• Field of Search: 336/65, 336/83, 336/200, 336206-208, 336/223, 336/232, 336/233, 257/531
• US Class Current: 336/200
• CPC Class Codes: H01F 17/0006 Printed inductances printed coils for dynamo-electric machines H02K3/26; printed circuits H05K
• CPC Class Codes: H01F 2017/0046 with a conductive path having a bridge
• CPC Class Codes: H01F 2017/008 Electric or magnetic shielding of printed inductances
• CPC Class Codes: H01F 41/042 by thin film techniques
• CPC Class Codes: H01F 41/046 structurally combined with ferromagnetic material
• CPC Class Codes: H01L 23/522 including external interconnections consisting of a multilayer structure of conductive and insulating layers inseparably formed on the semiconductor body
• CPC Class Codes: H01L 23/5227 Inductive arrangements or effects of, or between, wiring layers other inductive arrangements H01L23/645
• CPC Class Codes: H01L 23/552 Protection against radiation, e.g. light or electromagnetic waves
• CPC Class Codes: H01L 23/645 Inductive arrangements H01L23/647, H01L23/66 take precedence
• CPC Class Codes: H01L 27/08 including only semiconductor components of a single kind
• CPC Class Codes: H01L 28/10 Inductors
• CPC Class Codes: H01L 2924/00 Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
• CPC Class Codes: H01L 2924/0002 Not covered by any one of groups H01L24/00, H01L24/00 and H01L2224/00
• CPC Class Codes: Y10T 29/4902 Electromagnet, transformer or inductor
• CPC Class Codes: Y10T 29/49032 Fabricating head structure or component thereof
• CPC Class Codes: Y10T 29/49043 Depositing magnetic layer or coating
• CPC Class Codes: Y10T 29/49044 Plural magnetic deposition layers
• CPC Class Codes: Y10T 29/49048 Machining magnetic material [e.g., grinding, etching, polishing]
• CPC Class Codes: Y10T 29/49052 by etching
• CPC Class Codes: Y10T 29/49073 by assembling coil and core
• CPC Class Codes: Y10T 29/49075 : including permanent magnet or core
• CPC Class Codes: Y10T 29/49078 : Laminated
• CPC Class Codes: Y10T 29/49156 : with selective destruction of conductive paths

Abstract

An inductor comprises a substrate comprising a semiconductor material, a first dielectric layer over the substrate, a magnetic layer over the first dielectric layer, a second dielectric layer over the magnetic layer, and a conductor over the second dielectric layer.

Claims

1. An inductor comprising:

a substrate comprising a semiconductor material;

a first dielectric layer over the substrate;

a first magnetic layer over the first dielectric layer including a slot having a first shape;

a second dielectric layer over the first magnetic layer;

a conductor over the second dielectric layer having a second shape, the first shape is independent of the second shape;

a second magnetic layer over the conductor; and

wherein the first and second magnetic layers comprise an amorphous alloy comprising cobalt, zirconium, and at least one element selected from the list of tantalum, niobium, and a rare earth element.

2. An inductor comprising:

a substrate comprising a semiconductor material;

a first dielectric layer over the substrate;

a magnetic layer over the first dielectric layer;

a second dielectric layer over the magnetic layer; and

a conductor over the second dielectric layer, the conductor having a first shape;

wherein the magnetic layer defines at least one slot, the slot having a second shape independent of the first shape of the conductor.

3. An inductor comprising:

a substrate comprising a semiconductor material;

a first dielectric layer over the substrate;

a first magnetic layer over the first dielectric layer including a slot having a first shape;

a second dielectric layer over the first magnetic layer;

a conductor over the second dielectric layer having a second shape, the first shape is independent of the second shape;

a third dielectric layer over the conductor; and

a second magnetic layer over the third dielectric layer.

4. The inductor of claim 3, wherein the magnetic layers are connected.