Apparatus suitable for providing synchronized clock signals to a microelectronic device
First Claim
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1. A clock signal distribution device formed on a semiconductor substrate, comprising:
- a clock input;
a first driver coupled to said clock input;
a second driver coupled to said clock input;
a first receiver coupled to said first driver by a first plurality of transmission lines;
a second receiver coupled to said second driver by a second plurality of transmission lines;
said first and second plurality of transmission lines being configured to provide substantially equal time delays;
said first receiver configured to provide a first output connected to a first site on a microprocessor; and
said second receiver configured to provide a second output connected to a second site on said microprocessor.
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Abstract
A device for transmitting clock signals to a microprocessor is disclosed. The device is configured to receive a clock signal and distribute the signal synchronically to multiple output sites on the device. The synchronized clock signals are transmitted from the various device sites to multiple sites on the microprocessor.
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Citations
8 Claims
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1. A clock signal distribution device formed on a semiconductor substrate, comprising:
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a clock input;
a first driver coupled to said clock input;
a second driver coupled to said clock input;
a first receiver coupled to said first driver by a first plurality of transmission lines;
a second receiver coupled to said second driver by a second plurality of transmission lines;
said first and second plurality of transmission lines being configured to provide substantially equal time delays;
said first receiver configured to provide a first output connected to a first site on a microprocessor; and
said second receiver configured to provide a second output connected to a second site on said microprocessor. - View Dependent Claims (2, 3, 4, 5)
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6. An integrated circuit device formed on a semiconductor substrate and configured to provide synchronized clock signals to multiple sites on a utilization device located external to the semiconductor substrate, comprising:
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a clock input configured as a solder bump;
a first driver coupled to said clock input;
a second driver coupled to said clock input;
a first receiver coupled to said first driver by a first plurality of transmission lines;
a second receiver coupled to said second driver by a second plurality of transmission lines;
said first and second plurality of transmission lines being configured to provide substantially equal time delays;
said first receiver configured to provide a first output connected to a first site on a utilization device; and
said second receiver configured to provide a second output connected to a second site on said utilization device. wherein said first and second outputs are configured as solder bumps connected to first and second sites on said utilization device. - View Dependent Claims (7, 8)
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Specification