Semiconductor element, and method of forming silicon-based film
First Claim
1. A semiconductor element comprising a semiconductor junction composed of silicon-based films, wherein at least one of the silicon-based films contains a microcrystal, and an orientation property of the microcrystal in the silicon-based film containing the microcrystal changes in a film thickness direction of the silicon-based film containing the microcrystal.
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Abstract
The invention provides a semiconductor element having a semiconductor junction composed of silicon-based films, at least one of the silicon-based films containing a microcrystal. The microcrystal is located in at least one interface region of the silicon-based film containing the microcrystal and has no orientation property. Further, the invention provides a semiconductor element having a semiconductor junction composed of silicon-based films, at least one of the silicon-based films containing a microcrystal, and the orientation property of the microcrystal changing in a film thickness direction of the silicon-based film containing the microcrystal. Thereby, a silicon-based film having a shortened tact time, an increased film forming rate, and excellent characteristics, and a semiconductor element including this silicon-based film having excellent adhesion and environmental resistance can be obtained.
55 Citations
85 Claims
- 1. A semiconductor element comprising a semiconductor junction composed of silicon-based films, wherein at least one of the silicon-based films contains a microcrystal, and an orientation property of the microcrystal in the silicon-based film containing the microcrystal changes in a film thickness direction of the silicon-based film containing the microcrystal.
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24. A method of making a semiconductor element comprising a semiconductor junction composed of silicon-based films, at least one of the silicon-based films containing a microcrystal, the method comprising:
forming the silicon-based film containing the microcrystal such that the orientation property of the microcrystal changes in a film thickness direction of the silicon-based film containing the microcrystal. - View Dependent Claims (25, 26, 27, 28, 29, 30, 31, 32, 33, 34, 35, 36, 37, 38, 39, 40, 41, 42, 43)
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44. A semiconductor element comprising a semiconductor junction composed of silicon-based films, at least one of the silicon-based films containing a microcrystal,
wherein the microcrystal is located in at least one interface region of the silicon-based film containing the microcrystal and has no orientation property, wherein the semiconductor element includes at least one pin type semiconductor junction having a semiconductor layer exhibiting a first conductivity type, i-type semiconductor layers, and a semiconductor layer exhibiting a second conductivity type, the layers being mainly composed of silicon atoms and sequentially stacked on a substrate, and wherein an amorphous silicon layer is arranged between the silicon-based film containing the microcrystal and the semiconductor layer exhibiting the first or second conductivity type which is arranged on a light incidence side relative to the silicon-based film containing the microcrystal.
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46. A semiconductor element comprising a semiconductor junction composed of silicon-based films,
wherein at least one of the silicon-based films contains a microcrystal, and a microcrystal located in at least one interface region of the silicon-based film containing the microcrystal has no orientation property, and wherein in the silicon-based film containing the microcrystal, the ratio of the diffraction intensity of a (220) face of the microcrystal except for a non-orientation property region, which is measured with X rays or electron rays, to the total diffraction intensity changes in a film thickness direction of the silicon-based film.
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47. A semiconductor element comprising a semiconductor junction composed of silicon-based films,
wherein at least one of the silicon-based films contains a microcrystal, and a microcrystal located in at least one interface region of the silicon-based film containing the microcrystal has no orientation property, and wherein the orientation property of the microcrystal located in the interface region is such that when measured with X rays or electron rays, three diffraction faces (111), (220), and (311) arranged in this order from the small angle side have such diffraction intensities that when the (111) face has a diffraction intensity of 1, the (220) face has a diffraction intensity of 0.50 or more and 0.60 or less, whereas the (311) face has a diffraction intensity of 0.25 or more and 0.35 or less.
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50. A semiconductor element comprising a semiconductor junction composed of silicon-based films,
wherein at least one of the silicon-based films contains a microcrystal, and a microcrystal located in at least one interface region of the silicon-based film containing the microcrystal has no orientation property, and wherein in the silicon-based film containing the microcrystal, a microcrystal which is preferentially oriented along the (220) face is shaped in a column extending in a vertical direction relative to the substrate.
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51. A semiconductor element comprising a semiconductor junction composed of silicon-based films,
wherein at least one of the silicon-based films contains a microcrystal, and a microcrystal located in at least one interface region of the silicon-based film containing the microcrystal has no orientation property, and wherein the microcrystal located in the interface region is shaped in substantially a sphere.
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65. A method of making a semiconductor element comprising a semiconductor junction composed of silicon-based films, at least one of the silicon-based films containing a microcrystal, the semiconductor element including at least one pin type semiconductor junction having a semiconductor layer exhibiting a first conductivity type, i-type semiconductor layers, and a semiconductor layer exhibiting a second conductivity type, the layers being mainly composed of silicon atoms and sequentially stacked on a substrate, and an amorphous silicon layer being arranged between the silicon-based film containing the microcrystal and the semiconductor layer exhibiting the first or second conductivity type which is arranged on a light incidence side relative to the silicon-based film containing the microcrystal, the method comprising:
forming the silicon-based film containing the microcrystal such that the microcrystal is located in at least one interface region of the silicon-based film containing the microcrystal and has no orientation property. - View Dependent Claims (66, 67, 68, 69, 70, 71, 72, 73, 74, 75, 76, 77, 78, 79, 80, 81, 82, 83, 84, 85)
Specification