Wire bond package and packaging method

• US 6,858,474 B1
• Filed: 12/01/2003
• Issued: 02/22/2005
• Est. Priority Date: 12/01/2003
• Status: Expired due to Fees

• Current Assignee: Avago Technologies Wireless IP Singapore Pte Limited (Broadcom, Inc.)
• Original Assignee: Agilent Technologies, Inc.
• Inventors: Low, Beng Huat, Chew, Kong Hoong, Koay, Hean Tatt
• Primary Examiner(s): Nhu, David
• Application Number:
  US10/725,669
• Time in Patent Office: 449 Days
• Field of Search: 438/123, 438/51, 438/55, 438/64, 438/106, 438/107, 438/108, 438/110, 438/111, 438/113, 438/118, 438/122, 438/124, 438/125, 438/126, 438/127
• US Class Current: 438/123
• CPC Class Codes: H01L 21/561 Batch processing
• CPC Class Codes: H01L 21/565 Moulds
• CPC Class Codes: H01L 2224/32245 the item being metallic
• CPC Class Codes: H01L 2224/45144 Gold (Au) as principal constituent
• CPC Class Codes: H01L 2224/48091 Arched
• CPC Class Codes: H01L 2224/48095 Kinked
• CPC Class Codes: H01L 2224/48247 connecting the wire to a bond pad of the item
• CPC Class Codes: H01L 2224/73265 Layer and wire connectors
• CPC Class Codes: H01L 2224/83 using a layer connector
• CPC Class Codes: H01L 2224/85 using a wire connector
• CPC Class Codes: H01L 2224/97 the devices being connected to a common substrate, e.g. interposer, said common substrate being separable into individual assemblies after connecting
• CPC Class Codes: H01L 23/055 the leads having a passage through the base H01L23/057 takes precedence
• CPC Class Codes: H01L 23/3121 a substrate forming part of the encapsulation
• CPC Class Codes: H01L 23/315 the encapsulation having a cavity
• CPC Class Codes: H01L 23/49805 the leads being also applied on the sidewalls or the bottom of the substrate, e.g. leadless packages for surface mounting
• CPC Class Codes: H01L 23/49861 Lead-frames fixed on or encapsulated in insulating substrates H01L23/4985, H01L23/49805 take precedence
• CPC Class Codes: H01L 23/66 High-frequency adaptations
• CPC Class Codes: H01L 24/28 Structure, shape, material or disposition of the layer connectors prior to the connecting process
• CPC Class Codes: H01L 24/45 of an individual wire connector
• CPC Class Codes: H01L 24/48 of an individual wire connector
• CPC Class Codes: H01L 24/97 : the devices being connected to a common substrate, e.g. interposer, said common substrate being separable into individual assemblies after connecting
• CPC Class Codes: H01L 2924/00 : Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
• CPC Class Codes: H01L 2924/00014 : the subject-matter covered by the group, the symbol of which is combined with the symbol of this group, being disclosed without further technical details
• CPC Class Codes: H01L 2924/01029 : Copper [Cu]
• CPC Class Codes: H01L 2924/01033 : Arsenic [As]
• CPC Class Codes: H01L 2924/01079 : Gold [Au]
• CPC Class Codes: H01L 2924/01082 : Lead [Pb]
• CPC Class Codes: H01L 2924/078 : Adhesive characteristics other than chemical
• CPC Class Codes: H01L 2924/14 : Integrated circuits
• CPC Class Codes: H01L 2924/16195 : Flat cap [not enclosing an internal cavity]
• CPC Class Codes: H01L 2924/181 : Encapsulation

Abstract

A method for packaging a plurality of dies is disclosed. Each die is attached to a corresponding mounting station in a structural member that includes a base member having first and second surfaces and a plurality of mounting stations. Each mounting station has a cavity wall that surrounds that mounting station and extends from the first surface thereby forming an open cavity around the mounting station. After the dies have mounted, a lid sheet is positioned over the structural member. The lid sheet includes a plurality of covers for closing the cavities. The covers are connected to one another by connection members. The structural member with the positioned lid sheet is then placed in a mold with a molding compound in contact with the lid sheet. The mold has a surface that forces the covers against the cavity while forcing the molding compound between the cavity walls.

Claims

1. A method for packaging a plurality of dies, said method comprising:

providing a structural member comprising a base member having first and second surfaces, said base member comprising a plurality of mounting stations, each mounting station comprising a cavity wall that surrounds that mounting station and extends from said first surface thereby forming an open cavity around said mounting station;

attaching each die to a corresponding one of said mounting stations;

positioning a lid sheet over said structural member, said lid sheet comprising a plurality of covers for closing said cavities said covers being connected to one another by connection members;

placing said structural member with said positioned lid sheet in a mold with a molding compound in contact with said lid sheet, said mold having a surface that forces said covers against said cavity while forcing said molding compound between said cavity walls; and

causing said molding compound to solidify.

2. The method of claim 1 wherein one of said connection members comprises a spring member that extends away from said covers and said first surface.

3. The method of claim 2 wherein said mold surface is in contact with said spring member when said molding compound is forced between said cavity walls.

4. The method of claim 1 wherein one of said mounting stations comprises a wire bonding pad and wherein said die is connected to said wire bonding pad when said die is attached to said mounting station.

5. The method of claim 1 wherein one of said mounting stations comprises a die mounting pad and wherein said die is connected to said die mounting pad by a layer of adhesive when said die is attached to said mounting station.

6. The method of claim 5 wherein said die mounting pad comprises a heat sink for removing heat from said die.

7. The method of claim 1 wherein said base member comprises a lead frame that is partially encased in a mold compound.