Substrate for receiving a circuit configuration and method for producing the substrate

• US 6,858,807 B2
• Filed: 12/02/2002
• Issued: 02/22/2005
• Est. Priority Date: 05/30/2000
• Status: Expired due to Term

• Current Assignee: Infineon Technologies AG
• Original Assignee: EUPEC Europaeische Gesellschaft fuer Leistungshalbleiter mbH
• Inventors: Pelmer, Reimund, Ferber, Gottfried
• Primary Examiner(s): Cuneo, Kamand
• Assistant Examiner(s): PATEL, ISHWARBHAI B
• Application Number:
  US10/308,049
• Publication Number:
  US 20030110627A1
• Time in Patent Office: 813 Days
• Field of Search: 174/261, 174/252, 174/260, 361/709, 361/807, 361/809, 361/760, 361/772, 439/493, 298/30, 298/32
• US Class Current: 174/261
• CPC Class Codes: H01L 23/13 characterised by the shape
• CPC Class Codes: H01L 23/3735 Laminates or multilayers, e.g. direct bond copper ceramic substrates
• CPC Class Codes: H01L 23/49861 Lead-frames fixed on or encapsulated in insulating substrates H01L23/4985, H01L23/49805 take precedence
• CPC Class Codes: H01L 2924/00 Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
• CPC Class Codes: H01L 2924/0002 Not covered by any one of groups H01L24/00, H01L24/00 and H01L2224/00
• CPC Class Codes: H05K 1/0306 Inorganic insulating substrates, e.g. ceramic, glass
• CPC Class Codes: H05K 1/0393 Flexible materials H05K1/038 takes precedence; specific organic compositions are classified in H05K1/0313 and subgroups
• CPC Class Codes: H05K 2201/056 Folded around rigid support or component
• CPC Class Codes: H05K 2201/09036 Recesses or grooves in insulating substrate recess in metallic substrate H05K2201/09745
• CPC Class Codes: H05K 2203/302 Bending a rigid substrate; Breaking rigid substrates by bending rigid circuit boards or rigid supports locally made bendable H05K1/0278
• CPC Class Codes: H05K 3/3405 Edge mounted components, e.g. terminals
• CPC Class Codes: H05K 3/3421 Leaded components
• CPC Class Codes: H05K 3/4092 Integral conductive tabs, i.e. conductive parts partly detached from the substrate
• CPC Class Codes: Y02P 70/50 Manufacturing or production processes characterised by the final manufactured product
• CPC Class Codes: Y10T 29/49126 Assembling bases
• CPC Class Codes: Y10T 29/49128 Assembling formed circuit to base
• CPC Class Codes: Y10T 29/49147 Assembling terminal to base
• CPC Class Codes: Y10T 29/49155 Manufacturing circuit on or in base

Abstract

A substrate is adapted to accommodate a circuit configuration. The novel substrate is stable under alternating loads and it favorably dissipates heat. To this end, the substrate has a fastening zone to be connected to a contact element that is to be provided. The fastening zone is fixed on the carrier substrate with a first section. A second section projects from the plane of the carrier substrate, and the first and the second sections are adapted to be electrically and mechanically connected to the contact element.

Claims

1. A substrate for receiving a circuit configuration of electronic components, comprising:

a substantially planar carrier substrate defining a plane and having a surface;

a contact substrate formed at least partly of surface regions disposed on said surface of said carrier substrate and adapted to be connected to electronic components of the circuit configuration;

said contact substrate including a contiguous contact substrate region;

said contact substrate region having a first part forming a surface region disposed on and mechanically connected to said carrier substrate;

said contact substrate region having a second part projecting out of said plane of said carrier substrate;

said first part and said second part of said contact substrate region forming at least a part of a fixing region adapted to receive a contact element for conducting electrical current and for electrically and mechanically connecting to the contact element; and

at least one contact element electrically and mechanically connected to said contact substrate through said fixing region and configured to conduct electrical current, said contact element having a contact projecting out of said plane defined by said carrier substrate.

2. The substrate according to claim 1, wherein said carrier substrate is a ceramic carrier substrate.

3. The substrate according to claim 1, wherein said contact substrate is a metallic substrate.

4. The substrate according to claim 1, wherein said fixing region is disposed in an edge region of the substrate.

5. The substrate according to claim 1, wherein said fixing region forms an edge region of the substrate.

6. The substrate according to claim 1, which comprises an edge region oriented out of said plane of the substrate, said edge region forming at least a part of said fixing region.

7. The substrate according to claim 1, which comprises an edge region at least partly bent out of said plane of the substrate, said edge region forming at least a part of said fixing region.

8. The substrate according to claim 1, wherein said surface of said carrier substrate is a first surface, and wherein a heat sink is disposed on a second surface opposite said first surface.

9. The substrate according to claim 8, wherein said heat sink is a metallic heat dissipation layer.

10. The substrate according to claim 1, wherein the substrate is a direct copper bonded substrate.

11. The substrate according to claim 1, which comprises a soldering connection in each case electrically and mechanically connecting said contact element to each of said first part and said second part of said contact substrate region.

12. The substrate according to claim 1, which comprises a welding connection in each case electrically and mechanically connecting said contact element to each of said first part and said second part of said contact substrate region.

13. The substrate according to claim 1 configured for contacting and supporting a power semiconductor module thereon.

14. A method for producing the substrate according to claim 1, the method which comprises:

providing a carrier substrate defining a plane, and disposing a contact substrate thereon;

forming a recess in the carrier substrate at a predetermined bending location thereof substantially in a contiguous portion of the contact substrate;

bending the contiguous portion along the bending location defined by the recess to form a bending region projecting out of the plane of the carrier substrate and forming at least a part of a fixing region; and

connecting at least one contact element electrically and mechanically to the contact substrate at the fixing region, the contact element having a contact projecting out of the plane defined by the carrier substrate and configured to conduct electrical current.

15. The method according to claim 14, which comprises producing the substrate in a direct copper bonding process.

16. The method according to claim 14, which further comprises electrically and mechanically connecting at least one contact element to the contact substrate via the fixing region, the contact element having a contact projecting out of the plane defined by the carrier substrate and being configured to conduct electrical current.

17. The method according to claim 16, which comprises soldering or welding the contact element to each of the first part and the second part of the contact substrate region.

18. The method according to claim 14, which comprises configuring the carrier substrate and the contact substrate for connection to a power semiconductor module.

19. A substrate for receiving a circuit configuration of electronic components, comprising:

a carrier substrate defining a plane;

a contact substrate disposed on said carrier substrate;

a recess formed in said carrier substrate at a predetermined bending location thereof substantially in a contiguous portion of said contact substrate;

said contiguous portion being bent along said bending location defined by said recess forming a bending region projecting out of said plane of said carrier substrate and forming at least a part of a fixing region; and

at least one contact element electrically and mechanically connected to said contact substrate through said fixing region, said contact element having a contact projecting out of said plane defined by said carrier substrate and configured to conduct electrical current.

20. The substrate according to claim 19, wherein the substrate is a direct copper bonded substrate.

21. The substrate according to claim 19, which comprises one of a soldered and welded connection connecting said contact element to each of said first part and said second part of said contact substrate region.

22. The substrate according to claim 19, wherein said carrier substrate and said contact substrate are configured for connecting a power semiconductor module.