Semiconductor diode having a semiconductor die with a substrate and multiple films applied thereover

• US 6,858,873 B2
• Filed: 01/23/2002
• Issued: 02/22/2005
• Est. Priority Date: 01/23/2002
• Status: Expired due to Fees

• Current Assignee: Walsin Lihwa Corporation
• Original Assignee: Chia Ta World Co., Ltd.
• Inventors: Lee, Ming-Kwei
• Primary Examiner(s): Lee, Eddie
• Assistant Examiner(s): Owens, Douglas W.
• Application Number:
  US10/052,466
• Publication Number:
  US 20030136965A1
• Time in Patent Office: 1,126 Days
• Field of Search: 257/81, 257/79, 257/84, 257/99, 257/46
• US Class Current: 257/81
• CPC Class Codes: H01L 33/38 with a particular shape
• CPC Class Codes: H01L 33/387 with a plurality of electrode regions in direct contact with the semiconductor body and being electrically interconnected by another electrode layer

Abstract

A semiconductor diode has a semiconductor die that includes a substrate, a first semiconductor film, a second semiconductor film, a first metal contact, and a second metal contact. The semiconductor die defines two diagonally opposite first corners and two diagonally opposite second corners. The first semiconductor film has an exposed area that is exposed from the second semiconductor film and that extends between one of the first corners and one of the second corners. The first metal contact is formed on the exposed area and has an extension section and a wire-bonding section that has a width greater than that of the extension section and a length less than that of the extension section. The second metal contact extends between the other one of the first corners and the other one of the second corners and has an extension section and a wire-bonding section that has a width greater than that of the extension section and a length less than that of the extension section.

Claims

1. A semiconductor diode comprising:

a semiconductor die including a substrate, a first semiconductor film formed on said substrate, a second semiconductor film formed on said first semiconductor film, a first metal contact formed on said first semiconductor film, and a second metal contact formed on said second semiconductor film, one of said first and second semiconductor films being made of an n-type semiconductor material, the other one of said first and second semiconductor films being made of a p-type semiconductor material, said semiconductor die having two opposing first side edges a and b and two opposing second side edges c and d which cooperate with said first side edges a and b to define two diagonally opposite first corners a and b and two diagonally opposite second corners c and d, said first semiconductor film having an exposed area that is exposed from said second semiconductor film adjacent to first side edge a and that extends between said first corner a and said second corner c, said first metal contact having a first strip portion that is formed on said exposed area, and a first bonding portion that extends from and that has a width greater than that of said first strip portion and a length less than that of said first strip portion, said second metal contact having a second strip portion that is disposed adjacent to said first side edge b and that extends between said first corner b and said second corner d, and a second bonding portion that extends from and that has a width greater than that of said second strip portion and a length less than that of said second strip portion, said first bonding portion being formed on said one of said first corners a and b, said first strip portion extending from said first bonding portion to said one of said second corners c and d, said second bonding portion being formed on the other side of said first corners a and b, said second strip portion extending from said second bonding portion to the other one of said second corners c and d.

2. The semiconductor diode of claim 1, further comprising a quantum well sandwiched between said first and second semiconductor films.

3. The semiconductor diode of claim 1, further comprising an ohmic metal contacting film sandwiched between said second semiconductor film and said second metal contact.

4. The semiconductor diode of claim 3, further comprising a dielectric film sandwiched between said second metal contact and said metal contacting film, said dielectric film having a geometric dimension less than that of said second metal contact such that said second metal contact is in electrical contact with said metal contacting film.

5. The semiconductor diode of claim 1, wherein said substrate is made of a material selected from a group consisting of sapphire and silicon carbide.

6. The semiconductor diode of claim 1, wherein said n-type semiconductor material is n-doped GaN material, and said p-type semiconductor material is p-doped GaN material.

7. A semiconductor diode comprising:

a semiconductor die including a substrate, a first semiconductor film formed on said substrate, a second semiconductor film formed on said first semiconductor film, a first metal contact formed on said first semiconductor film, and a second metal contact formed on said second semiconductor film, one of said first and second semiconductor films being made of an n-type semiconductor material, the other one of said first and second semiconductor films being made of a p-type semiconductor material, said semiconductor die having two opposing first side edges a and b and two opposing second side edges c and d which cooperate with said first side edges a and b to define two diagonally opposite first corners a and b and two diagonally opposite second corners c and d, said first semiconductor film having an exposed area that is exposed from said second semiconductor film adjacent to first side edge a and that extends between said first corner a and said second corner c, said first metal contact having a first strip portion that is formed on said exposed area, and a first bonding portion that extends from and that has a width greater than that of said first strip portion and a length less than that of said first strip portion, said second metal contact having a second strip portion that is disposed adjacent to said first side edge b and that extends between said first corner b and said second corner d, and a second bonding portion that extends from and that has a width greater than that of said second strip portion and a length less than that of said second strip portion, said semiconductor diode further comprising a quantum well sandwiched between said first and second semiconductor films.

8. The semiconductor diode of claim 7, wherein said first bonding portion is formed on said one of said first corners a and b, said first strip portion extending from said first bonding portion to said one of said second corners c and d, said second bonding portion being formed on the other one of said first corners a and b, said second strip portion extending from said second bonding portion to the other one of said second corners c and d.

9. The semiconductor diode of claim 7, further comprising an ohmic metal contacting film sandwiched between said second semiconductor film and said second metal contact.

10. The semiconductor diode of claim 9, further comprising a dielectric film sandwiched between said second metal contact and said metal contacting film, said dielectric film having a geometric dimension less than that of said second metal contact such that said second metal contact is in electrical contact with said metal contacting film.

11. The semiconductor diode of claim 7, wherein said substrate is made of a material selected from a group consisting of sapphire and silicon carbide.

12. The semiconductor diode of claim 7, wherein said n-type semiconductor material is n-doped GaN material, and said p-type semiconductor material is p-doped GaN material.

13. A semiconductor diode comprising:

a semiconductor die including a substrate, a first semiconductor film formed on said substrate, a second semiconductor film formed on said first semiconductor film, a first metal contact formed on said first semiconductor film, and a second metal contact formed on said second semiconductor film, one of said first and second semiconductor films being made of an n-type semiconductor material, the other one of said first and second semiconductor films being made of a p-type semiconductor material, said semiconductor die having two opposing first side edges a and b and two opposing second side edges c and d which cooperate with said first side edges a and b to define two diagonally opposite first corners a and b and two diagonally opposite second corners c and d, said first semiconductor film having an exposed area that is exposed from said second semiconductor film adjacent to first side edge a and that extends between said first corner a and said second corner c, said first metal contact having a first strip portion that is formed on said exposed area, and a first bonding portion that extends from and that has a width greater than that of said first strip portion and a length less than that of said first strip portion, said second metal contact having a second strip portion that is disposed adjacent to said first side edge b and that extends between said first corner b and said second corner d, and a second bonding portion that extends from and that has a width greater than that of said second strip portion and a length less than that of said second strip portion, said semiconductor diode further comprising an ohmic metal contacting film sandwiched between said second semiconductor film and said second metal contact and a dielectric film sandwiched between said second metal contact and said metal contacting film, said dielectric film having a geometric dimension less than that of said second metal contact such that said second metal contact is in electrical contact with said metal contacting film.

14. The semiconductor diode of claim 13, wherein said first bonding portion is formed on said one of said first corners a and b, said first strip portion extending from said first bonding portion to said one of said second corners c and d, said second bonding portion being formed on the other one of said first comers a and b, said second strip portion extending from said second bonding portion to the other one of said second corners c and d.

15. The semiconductor diode of claim 13, further comprising a quantum well sandwiched between said first and second semiconductor films.

16. The semiconductor diode of claim 13, wherein said substrate is made of a material selected from a group consisting of sapphire and silicon carbide.

17. The semiconductor diode of claim 13, wherein said n-type semiconductor material is n-doped GaN material, and said p-type semiconductor material is p-doped GaN material.