Package for housing an optoelectronic assembly
First Claim
1. A package adapted to house an optoelectronic assembly, the package comprising:
- an insulating base having an upper surface, wherein an optoelectronic device is mounted to the upper surface of the insulating base;
an integrated circuit mounted adjacent to the optoelectronic device on the upper surface of the insulating base, wherein the integrated circuit is electrically connected to the optoelectronic device;
a first metal member having a top wall and a bottom wall, wherein the bottom wall of the first metal member is attached to the upper surface of the insulating base; and
a metal cover having a rim located at a bottom portion thereof, wherein the rim of the metal cover is adapted to attach to the top wall of the first metal member to hermetically seal the metal cover to the insulating base.
6 Assignments
0 Petitions
Accused Products
Abstract
A package for housing an optoelectronic device and an integrated circuit is disclosed. The package includes an insulating base having an upper surface. The optoelectronic device and the integrated circuit are mounted to the upper surface of the insulating base. The package also includes a metal sealing member having a top wall and a bottom wall. The bottom wall of the metal sealing member is attached to the upper surface of the insulating base. The package further includes a metal cover having a rim located at a bottom portion thereof. The rim of the metal cover is adapted to attach to the top wall of the metal sealing member to thereby hermetically seal the metal cover to the insulating base.
60 Citations
30 Claims
-
1. A package adapted to house an optoelectronic assembly, the package comprising:
-
an insulating base having an upper surface, wherein an optoelectronic device is mounted to the upper surface of the insulating base;
an integrated circuit mounted adjacent to the optoelectronic device on the upper surface of the insulating base, wherein the integrated circuit is electrically connected to the optoelectronic device;
a first metal member having a top wall and a bottom wall, wherein the bottom wall of the first metal member is attached to the upper surface of the insulating base; and
a metal cover having a rim located at a bottom portion thereof, wherein the rim of the metal cover is adapted to attach to the top wall of the first metal member to hermetically seal the metal cover to the insulating base. - View Dependent Claims (2, 3, 4, 5, 6, 7, 8, 9, 10, 11, 12, 13, 14, 15, 16, 17)
-
-
18. A method for hermetically sealing a metal cover to an insulating base, comprising:
-
mounting an optoelectronic device to an upper surface of the insulating base;
mounting an integrated circuit adjacent to the optoelectronic device on the upper surface of the insulating base, wherein the integrated circuit is electrically connected to the optoelectronic device;
attaching a bottom wall of a first metal member to the upper surface of the insulating base;
positioning a metal cover over the optoelectronic device and the integrated circuit, wherein the metal cover includes a rim at a bottom portion thereof; and
attaching the rim of the metal cover to a top wall of the first metal member to hermetically enclose both the optoelectronic device and the integrated circuit. - View Dependent Claims (19, 20, 21, 22, 23, 24, 25)
-
-
26. An automated process for manufacturing a package, wherein the package is adapted to house an optoelectronic assembly, the automated process comprising:
-
providing an insulating substrate having an upper surface anal a lower surface, wherein the insulating substrate includes a plurality of vias formed through the upper and lower surfaces of the insulating substrate, and wherein the plurality of vias is filled with a conductive material;
forming a metallization layer on each of the upper and lower surfaces of the insulating substrate;
attaching a metal sealing ring to the upper metallized surface of the insulating substrate;
mounting the optoelectronic assembly to the upper metallized surface of the insulating substrate and within an inner region of the metal sealing ring, wherein the optoelectronic assembly includes at least one optical device and at least one integrated circuit electrically connected to the optical device;
aligning a metal cap over the optoelectronic assembly; and
sealing the metal cap to the insulating substrate to hermetically enclose the optoelectronic assembly. - View Dependent Claims (27)
-
-
28. A packaged optical module, comprising:
-
a base formed of an electrically insulating material and having at least a first surface and a second surface, wherein an optical device and an electronic circuit electrically connected to the optical device are mounted to the base at the first surface;
a sealing member formed of an electrically conducting material and attached to the base, wherein the sealing member extends along a perimeter of the base with the optical device and the electronic circuit being located within an inner region of the sealing member;
a heat dissipating device attached to the second surface of the base; and
a cover formed of the electrically conducting material, wherein the cover is adapted to attach to the sealing member on the base to provide a hermetic enclosure for the optical device and the electronic circuit. - View Dependent Claims (29, 30)
-
Specification