Electroless plating processes

• US 6,861,097 B1
• Filed: 10/14/1998
• Issued: 03/01/2005
• Est. Priority Date: 10/17/1997
• Status: Expired due to Term

• Current Assignee: Shipley Company, LLC (Dow, Inc.)
• Original Assignee: Shipley Company, LLC (Dow, Inc.)
• Inventors: Poole, Mark A., Goosey, Martin T., Holland, Rebecca, Buch, Joachim, Graves, John E., Hirst, Deborah
• Primary Examiner(s): Talbot, Brian K.
• Application Number:
  US09/172,533
• Time in Patent Office: 2,330 Days
• Field of Search: 216/13, 216/56, 216/83, 106/1.05, 106/1.11, 427/301, 427/304, 427/306, 427/307
• US Class Current: 427/304
• CPC Class Codes: C23C 18/1653 Two or more layers with at least one layer obtained by electroless plating and one layer obtained by electroplating
• CPC Class Codes: C23C 18/1658 with two steps starting with metal deposition followed by addition of reducing agent
• CPC Class Codes: C23C 18/22 Roughening, e.g. by etching
• CPC Class Codes: H05K 3/181 by electroless plating adhesives therefor H05K3/387

Abstract

The invention includes processes for combined polymer surface treatment and metal deposition. Processes of the invention include forming an aqueous solution containing a metal activator, such as an oxidized species of silver, cobalt, ruthenium, cerium, iron, manganese, nickel, rhodium, or vanadium. The activator can be suitably oxidized to a higher oxidation state electrochemically. Exposing a part to be plated (such as an organic resin, e.g. a printed circuit board substrate) to the solution enables reactive hydroxyl species (e.g. hydroxyl radicals) to be generated and to texture the polymer surface. Such texturing facilitates good plated metal adhesion. As part of this contacting process sufficient time is allowed for both surface texturing to take place and for the oxidized metal activator to adsorb onto said part. The part is then contacted with a reducing agent capable of reducing the metal activator to a lower ionic form, or a lower oxidation state. That reduction can result in the formation of metallic catalytic material over the surface of the part. The reduced metal activator can then function to catalyze the electroless deposition of metal such as copper from solution by contacting the part with the plating solution.

Claims

1. A process for metal deposition comprising:

(a) providing an aqueous solution comprising one or more metal activator species;

(b) contacting a part to be plated with the solution comprising one or more metal activator species, wherein the one or more metal activator species are oxidized to generate hydroxyl species;

(c) etching the part with reactive hydroxyl species generated from water as a result of presence of the metal activator species in the aqueous solution;

(d) contacting the part with a solution of reducing agent capable of reducing the metal activator species; and

(e) metal plating the part by contact with an electroless plating solution;

wherein the metal activator species is one or more agents chosen from silver (II), cobalt (III), ruthenium (V), (VI), (VII), (VIII), cerium (III) or (IV), iron (I)) or (III), manganese (IV or higher), rhodium (IV) or vanadium (IV) or (V).

2. The process of claim 1 wherein the part is immersed in an aqueous solution comprising one or more metal activator species.

3. The process of claim 1 wherein the metal activator is oxidized electrochemically.

4. The process of claim 1 wherein the metal activator is selected from cobalt (III), ruthenium (V), (VI), (VII), (VIII), cerium (III) or (IV), iron (I)) or (III), manganese (IV or higher), rhodium (IV) or vanadium (IV) or (V).

5. The process of claim 1 wherein the metal activator is silver.

6. The process of claim 1 wherein the metal activator is cobalt.

7. The process of claim 1 wherein the part comprises an organic plastic.

8. The process of claim 1 wherein the part comprises acrylonitrile butadiene styrene, polyamide, epoxy, polycarbonate, or polyetherimide, or blends thereof.