Electrically programmable three-dimensional memory
First Claim
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1. An electrically programmable three-dimensional integrated memory (EP-3DiM), comprising:
- a substrate circuit, said substrate circuit further comprising a substrate integrated circuit and an address-decoder, said substrate integrated circuit comprising an embedded RWM and/or an embedded processor;
at least an electrically programmable three-dimensional memory (EP-3DM) level, said EP-3DM level being stacked on top of said substrate circuit and connected with said substrate circuit through a plurality of inter-level connecting vias, said address-decoder decoding address for at least a portion of said EP-3DM level.
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Abstract
One greatest advantage of the three-dimensional memory (3D-M) is its integratibility. In a electrically programmable three-dimensional integrated memory (EP-3DiM), an electrically programmable 3D-M (EP-3DM) is integrated with an embedded RWM and/or an embedded processor. Collectively, the EP-3DiM excels in speed, density/cost, programmability and data security.
25 Citations
20 Claims
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1. An electrically programmable three-dimensional integrated memory (EP-3DiM), comprising:
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a substrate circuit, said substrate circuit further comprising a substrate integrated circuit and an address-decoder, said substrate integrated circuit comprising an embedded RWM and/or an embedded processor;
at least an electrically programmable three-dimensional memory (EP-3DM) level, said EP-3DM level being stacked on top of said substrate circuit and connected with said substrate circuit through a plurality of inter-level connecting vias, said address-decoder decoding address for at least a portion of said EP-3DM level. - View Dependent Claims (2, 3, 4, 5, 6, 7, 8, 9, 10, 11, 12, 13, 14, 15)
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16. An electrically programmable player-on-a-chip (EP-PonC), comprising:
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a substrate circuit, said substrate circuit further comprising an embedded media-player;
at least an electrically programmable three-dimensional memory (EP-3DM) level, said EP-3DM level being stacked on top of said substrate circuit and connected with said substrate circuit through a plurality of inter-level connecting vms, at least a portion of said EP-3DM level storing multimedia contents;
whereby said embedded media-player can process said multimedia contents stored in said PP-3DM level. - View Dependent Claims (17, 18, 19)
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20. An electrically programmable computer-on-a-chip (EP-ConC), comprising:
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a substrate circuit, said substrate circuit further comprising an embedded processor and an embedded RAM;
at least an electrically programmable three-dimensional memory (EP-3DM) level, said EP-3DM level being stacked on top of said substrate circuit and connected with said substraic circuit ibrough a plurality of inter-level connecting visa, at least a portion of said EP-3DM level storing software code;
whereby said embedded RAM can store at least a portion of said software code from said EP-3DM level, and said embedded processor can process data and code stored in said embedded RAM.
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Specification