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Electrically programmable three-dimensional memory

  • US 6,861,715 B2
  • Filed: 07/08/2003
  • Issued: 03/01/2005
  • Est. Priority Date: 04/08/2002
  • Status: Active Grant
First Claim
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1. An electrically programmable three-dimensional integrated memory (EP-3DiM), comprising:

  • a substrate circuit, said substrate circuit further comprising a substrate integrated circuit and an address-decoder, said substrate integrated circuit comprising an embedded RWM and/or an embedded processor;

    at least an electrically programmable three-dimensional memory (EP-3DM) level, said EP-3DM level being stacked on top of said substrate circuit and connected with said substrate circuit through a plurality of inter-level connecting vias, said address-decoder decoding address for at least a portion of said EP-3DM level.

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