Module and electronic device

• US 6,861,731 B2
• Filed: 02/27/2002
• Issued: 03/01/2005
• Est. Priority Date: 03/02/2001
• Status: Expired due to Term

• Current Assignee: III Holdings 6, LLC (Intellectual Ventures LLC)
• Original Assignee: Koninklijke Philips Electronics N.V. (Koninklijke Philips N.V.)
• Inventors: Verspeek, Johannes Maria Cornelis, Buijsman, Adrianus Alphonsus Jozef, De Graauw, Antonius Johannes Matheus
• Primary Examiner(s): Whitehead, Jr., Carl
• Assistant Examiner(s): MENZ, LAURA MARY
• Application Number:
  US10/085,669
• Publication Number:
  US 20020167060A1
• Time in Patent Office: 1,098 Days
• Field of Search: 257/664, 257/728, 257/659, 257/796, 257/730, 257/678, 257/679, 257/680, 257/681, 257/687, 257/688, 257/689, 257/693, 257/422, 257/421, 257/425, 257/428, 361/818, 361/752, 361/800, 361/302, 333/247, 333/260
• US Class Current: 257/664
• CPC Class Codes: H01L 2223/6677 for antenna, e.g. antenna included within housing of semiconductor device
• CPC Class Codes: H01L 2224/05599 Material
• CPC Class Codes: H01L 2224/45015 being circular
• CPC Class Codes: H01L 2224/45099 Material
• CPC Class Codes: H01L 2224/48091 Arched
• CPC Class Codes: H01L 2224/48227 connecting the wire to a bond pad of the item
• CPC Class Codes: H01L 2224/85399 Material
• CPC Class Codes: H01L 23/552 Protection against radiation, e.g. light or electromagnetic waves
• CPC Class Codes: H01L 24/48 of an individual wire connector
• CPC Class Codes: H01L 2924/00 Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
• CPC Class Codes: H01L 2924/00014 the subject-matter covered by the group, the symbol of which is combined with the symbol of this group, being disclosed without further technical details
• CPC Class Codes: H01L 2924/09701 Low temperature co-fired ceramic [LTCC]
• CPC Class Codes: H01L 2924/14 Integrated circuits
• CPC Class Codes: H01L 2924/16151 Cap comprising an aperture, e.g. for pressure control, encapsulation
• CPC Class Codes: H01L 2924/16152 Cap comprising a cavity for hosting the device, e.g. U-shaped cap
• CPC Class Codes: H01L 2924/1617 Cavity coating
• CPC Class Codes: H01L 2924/19041 being a capacitor
• CPC Class Codes: H01L 2924/207 Diameter ranges
• CPC Class Codes: H01L 2924/3025 Electromagnetic shielding
• CPC Class Codes: H01Q 1/2291 used in bluetooth or WI-FI devices of Wireless Local Area Networks [WLAN] H01Q1/241 takes precedence; WLAN in general H04W
• CPC Class Codes: H01Q 1/38 : formed by a conductive layer on an insulating support patch antennas H01Q9/0407; microstrip dipole antennas H01Q9/065; microstrip slot antennas H01Q13/106; transmission line microstrip antennas H01Q13/206; manufacturing reflecting surfaces using insulating material for supporting the reflecting surface H01Q15/142
• CPC Class Codes: H01Q 23/00 : Antennas with active circuits or circuit elements integrated within them or attached to them
• CPC Class Codes: H04B 1/38 : Transceivers, i.e. devices in which transmitter and receiver form a structural unit and in which at least one part is used for functions of transmitting and receiving

Abstract

A radio module (10) suitable for RF applications, especially for Bluetooth, comprises a substrate (1) with a semiconductor device (11), a shield (21), and an antenna (31). The shield (21) is located between the antenna (31) and the semiconductor device (11), and is present on the same side (2) of the substrate (1) as the semiconductor device (11) and the antenna (31). By preference, the antenna (31) and the shield (21) are connected to one another by support means (32, 42).

Claims

1. A module comprising:

a substrate with a side,

a semiconductor device,

a shield of an electrically conducting material, and

an antenna mounted on the substrate, said shield being present between the antenna and the semiconductor device,

wherein the shield and the antenna are present substantially at the same side of the substrate as the semiconductor device, wherein the shield is connected to the antenna by a support, and wherein the support is a strip having a first end and a second end, which strip is undetachably connected at its first end to the metal plate of the antenna and is fastened at its second end to the shield.

2. A module as claimed in claim 1, wherein the shield and the antenna are metal plates which each comprise a first, a second, and a third portion, said second portion adjoining the first and the third portion and being oriented substantially parallel to the substrate, while at least one of said first and third portions is connected with electrical conduction to electrical conductors at one of the sides of the substrate.

3. A module as claimed in claim 2, wherein the support comprises a rubbery, electrically insulating material.

4. A module as claimed in claim 2, wherein the third portion of the antenna is provided with teeth which are connected to the electrical conductor at one of the sides of the substrate.

8. The module of claim 1, wherein a carrier is present on which the module and at least one component are fastened, which component emits radiation during operation of the device, the module arid the component each having a height with respect to the carrier such that the height of the module is greater than the height of the component.

9. The module of claim 1, wherein at least a portion of the shield and of the antenna are exposed to air so as to provide for the removal of heat from the module.

10. The module of claim 1, Wherein the support is Connected by an electrically conductive glue.

5. A module comprising:

a substrate with a side,

a semiconductor device,

a shield of an electrically conducting material, and

an antenna mounted on the substrate, said shield being present between the antenna and the semiconductor device.

wherein the shield and the antenna are present substantially at the same side of the substrate as the semiconductor device, wherein the shield is connected to the antenna to the antenna by a support wherein the support is the carder of the antenna and comprises an electrically insulating material, the shield is a metal plate which comprises a first, a second, and a third portion, said second portion adjoining the first and the third portion and being oriented substantially parallel to the substrate, while at least one of said first and third portions are connected with electrical conduction to electrical conductors at one of the sides of the substrate, and the support is fastened on the shield.

11. The module of claim 5, wherein at least a portion of the shield and of the antenna are exposed to air so as to provide for the removal of heat from the module.

6. A module comprising:

a substrata with a side,

a semiconductor device,

a shield of an electrically conducting material, and

an antenna mounted on the substrate, said shield being present between the antenna and the semiconductor device,

wherein the shield and the antenna are present substantially at the same side of the substrate an the semiconductor device, wherein the shield is connected to the antenna to the antenna by a support and wherein the support is the carrier of the antenna and of the shield.

7. A module as claimed in claim 6, wherein the support comprises a first, a second, and a third portion, said second portion adjoining the first and the third portion and being oriented so as to be substantially parallel to the substrate, while said first and third portions extend up to the substrate.

12. The module of claim 6, at least a portion of the shield and of the antenna are exposed to air so as to provide for the removal of heat from the module.