Substrate holding device, semiconductor manufacturing apparatus and device manufacturing method
First Claim
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1. An apparatus for holding a substrate, said apparatus comprising:
- a base member, which includes a plurality of projections, on which a plate is to be held, the substrate to be held on a plurality of projections of the plate;
a first attraction mechanism, which attracts the substrate toward the plate; and
a second attraction mechanism, which attracts the plate toward said base member, wherein said projections of said base member are arranged so that the projections of the plate can be placed coaxially with said projections of said base member.
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Abstract
A substrate holding device includes a base member capable of removably holding a plate having a contact member to come into contact with a substrate. The base member flatten-corrects the plate by suctioning the plate. The substrate holding device further includes a first attracting mechanism that attracts the substrate onto the plate in a status such that the plate is held on the base member, and a second attraction mechanism that attracts the plate onto the base member.
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Citations
26 Claims
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1. An apparatus for holding a substrate, said apparatus comprising:
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a base member, which includes a plurality of projections, on which a plate is to be held, the substrate to be held on a plurality of projections of the plate;
a first attraction mechanism, which attracts the substrate toward the plate; and
a second attraction mechanism, which attracts the plate toward said base member, wherein said projections of said base member are arranged so that the projections of the plate can be placed coaxially with said projections of said base member. - View Dependent Claims (2, 3, 4, 5, 6, 7, 8, 9, 10, 11, 14)
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12. A semiconductor manufacturing apparatus comprising:
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a holding unit, which holds a substrate, including;
(i) a base member, which includes a plurality of projections, on which a plate is to be held, the substrate to be held on a plurality of projections of the plate;
(ii) a first attraction mechanism, which attracts the substrate toward the plate; and
(iii) a second attraction mechanism, which attracts the plate toward said base member, wherein said projections of said base member are arranged so that the projections of the plate can be placed coaxially with the projections of the base member; and
a process unit, which processes the substrate held by said holding unit.
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13. A semiconductor manufacturing method comprising:
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a holding step of holding a substrate using an apparatus including;
(i) a base member, which includes a plurality of projections, on which a plate is to be held, the substrate to be held on a plurality of projections of the plate;
(ii) a first attraction mechanism, which attracts the substrate toward the plate; and
(iii) a second attraction mechanism, which attracts the plate toward said base member, wherein said projections of the base member are arranged so that the projections of the plate can be placed coaxially with the projections of the base member; and
a process step of processing the substrate being held in the holding step.
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15. An apparatus for holding a substrate, said apparatus comprising:
a base member having plurality of projections;
a plate having a plurality of projections on which the substrate is to be held;
a transfer system which transfers said plate onto said base member so that said projections of said plate are placed coaxially with said projections of said base member; and
a fixing system which fixes said plate, transferred by said transfer system, onto said base member. - View Dependent Claims (16, 17, 18, 19, 20, 21, 22, 23, 24, 25, 26)
Specification