Printed circuit board support

• US 6,863,170 B2
• Filed: 02/27/2003
• Issued: 03/08/2005
• Est. Priority Date: 11/01/2000
• Status: Expired due to Fees

• Current Assignee: Micron Technology, Inc.
• Original Assignee: Micron Technology, Inc.
• Inventors: Gordon, Brian F., Godfrey, John S., Teitenberg, Tony M.
• Primary Examiner(s): RIDLEY, RICHARD W L
• Application Number:
  US10/375,818
• Publication Number:
  US 20030136637A1
• Time in Patent Office: 740 Days
• Field of Search: 198/345.2, 298/32, 298/29, 298/37, 298/90, 298/46, 297/60, 299/39, 269/56, 269/71, 269/289.R, 269/8
• US Class Current: 198/345.2
• CPC Class Codes: H05K 13/0069 Holders for printed circuit boards
• CPC Class Codes: Y10T 29/49144 by metal fusion
• CPC Class Codes: Y10T 29/53174 Means to fasten electrical component to wiring board, base, or substrate
• CPC Class Codes: Y10T 29/53196 Means to apply magnetic force directly to position or hold work part
• CPC Class Codes: Y10T 29/53265 with work-holder for assembly

Abstract

A method of conveying a printed circuit board in a printed circuit board conveying system. The conveying system comprises a pair of conveyor rails and a printed circuit board support assembly. The rails are positioned to engage opposite lateral edge portions of a printed circuit board and configured to convey the printed circuit board along a conveyor path. The support assembly is positioned to support a major portion of the printed circuit board between the lateral edge portions and comprises a support base and a spacer selected from a plurality of spacers. The method comprises selecting a spacer as a function of its thickness and a thickness profile of the printed circuit board engaged by the pair of conveyor rails, installing the selected spacer by extending at least one projection into a recess, and engaging an upper spacer surface of the selected spacer with the printed circuit board. It is emphasized that this abstract is provided to comply with the rules requiring an abstract that will allow a searcher or other reader to quickly ascertain the subject matter of the technical disclosure. It is submitted with the understanding that it will not be used to interpret or limit the scope or meaning of the claims. 37 CFR §1.72(b).

Claims

1. A method of conveying a printed circuit board in a printed circuit board conveying system wherein said conveying system comprises:

a pair of conveyor rails positioned to engage opposite lateral edge portions of a printed circuit board and configured to convey said printed circuit board along a conveyor path; and

a printed circuit board support assembly positioned to support said printed circuit board between said lateral edge portions, said printed circuit board support assembly comprising

a support base defining a support surface and at least one recess formed therein, said recess defining an opening on said support surface; and

a spacer defining an upper spacer surface and an opposite spacer surface, wherein

said upper spacer surface is sized and configured to support and engage said printed circuit board,

said spacer includes at least one projection extending from said opposite spacer surface, and

said projection and said recess formed in said support base are sized to enable extension of said projection into said recess and to limit movement of said spacer relative to a plane parallel to said support surface;

and wherein said method comprises;

selecting said spacer from a plurality of spacers as a function of its thickness and a thickness profile of said printed circuit board engaged by said pair of conveyor rails, wherein said plurality of spacers define a range of respective thickness dimensions between respective ones of said upper spacer surfaces and corresponding ones of said opposite spacer surfaces;

installing said selected spacer by extending said projection into said recess; and

engaging said upper spacer surface of said selected spacer with said printed circuit board.

2. A method of conveying a printed circuit board in a printed circuit board conveying system wherein said conveying system comprises:

a pair of conveyor rails positioned to engage opposite lateral edge portions of a printed circuit board and configured to convey said printed circuit board along a conveyor path; and

a printed circuit board support positioned to support said printed circuit board between said lateral edge portions, said printed circuit board support comprising

a support base defining a support surface; and

a base extension assembly secured to said support base and arranged to define a variable extension assembly height dimension and at least a portion of a height dimension of said printed circuit board support, wherein

said base extension assembly comprises a viscously damped extension arranged to compress in response to a force applied to said support surface,

variation of said variable extension assembly height dimension results in variation of said height dimension of said printed circuit board support, and

said base extension assembly is configured such that said height dimension of said printed circuit board support permits engagement of said support surface with said printed circuit board;

and wherein said method comprises;

engaging said support surface of said support base with said printed circuit board engaged by said pair of conveyor rails; and

varying said height dimension of said base extension assembly as a function of a thickness profile of said printed circuit board.

3. A method of processing a printed circuit board in a processing system including a printed circuit board conveying system coupling a printed circuit board loader to a stencil printer, a pick and place machine, and a reflow oven, wherein said printed circuit board conveying system comprises:

a pair of conveyor rails positioned to engage opposite lateral edge portions of a printed circuit board and configured to convey said printed circuit board along a conveyor path; and

a printed circuit board support assembly positioned to support said printed circuit board between said lateral edge portions within an operating envelope of said pick and place machine, said printed circuit board support assembly comprising

a support base defining a support surface and at least one recess formed therein, said recess defining an opening on said support surface; and

a spacer defining an upper spacer surface and an opposite spacer surface, wherein

said upper spacer surface is sized and configured to support and engage said printed circuit board,

said spacer includes at least one projection extending from said opposite spacer surface, and

said projection and said recess formed in said support base are sized to enable extension of said projection into said recess and to limit movement of said spacer relative to a plane parallel to said support surface;

and wherein said method comprises;

selecting said spacer from a plurality of spacers as a function of its thickness and a thickness profile of said printed circuit board engaged by said pair of conveyor rails, wherein said plurality of spacers define a range of respective thickness dimensions between respective ones of said upper spacer surfaces and corresponding ones of said opposite spacer surfaces;

installing said selected spacer by extending said projection into said recess; and

engaging said upper spacer surface of said selected spacer with said printed circuit board within said operating envelope of said pick and place machine.

4. A method of processing a printed circuit board in a processing system including a printed circuit board conveying system coupling a printed circuit board loader to a stencil printer, a pick and place machine, and a reflow oven, wherein said printed circuit board conveying system comprises:

a pair of conveyor rails positioned to engage opposite lateral edge portions of a printed circuit board and configured to convey said printed circuit board along a conveyor path; and

a printed circuit board support positioned to support said printed circuit board between said lateral edge portions within an operating envelope of said pick and place machine, said printed circuit board support comprising

a support base defining a support surface; and

a base extension assembly secured to said support base and arranged to define a variable extension assembly height dimension and at least a portion of a height dimension of said printed circuit board support, wherein

said base extension assembly comprises a viscously damped extension arranged to compress in response to a force applied to said support surface,

variation of said variable extension assembly height dimension results in variation of said height dimension of said printed circuit board support, and

said base extension assembly is configured such that said height dimension of said printed circuit board support permits engagement of said support surface with said printed circuit board;

and wherein said method comprises;

engaging said support surface of said support base with said printed circuit board engaged by said pair of conveyor rails within said operating envelope of said pick and place machine; and

varying said height dimension of said base extension assembly as a function of a thickness profile of said printed circuit board.

5. A method of supporting a printed circuit board by a printed circuit board support assembly wherein said printed circuit board support assembly comprises:

a support base defining a support surface and at least one recess formed therein, said recess defining an opening on said support surface; and

a spacer defining an upper spacer surface and an opposite spacer surface, wherein

said upper spacer surface is sized and configured to support and engage a substantially major portion of said printed circuit board,

said spacer includes at least one projection extending from said opposite spacer surface, and

said projection and said recess formed in said support base are sized to enable extension of said projection into said recess and to limit movement of said spacer relative to a plane parallel to said support surface;

and wherein said method comprises;

selecting said spacer from a plurality of spacers as a function of its thickness and a thickness profile of said printed circuit board engaged by said upper spacer surface, wherein said plurality of spacers define a range of respective thickness dimensions between respective ones of said upper spacer surfaces and corresponding ones of said opposite spacer surfaces;

installing said selected spacer by extending said projection into said recess; and

engaging said upper spacer surface of said selected spacer with said printed circuit board.