Apparatuses and methods for forming electronic assemblies

• US 6,863,219 B1
• Filed: 08/17/2001
• Issued: 03/08/2005
• Est. Priority Date: 08/17/2001
• Status: Expired due to Term

• Current Assignee: RUIZHANG TECHNOLOGY LIMITED COMPANY
• Original Assignee: Alien Technology Corporation
• Inventors: Stewart, Roger Green, Jacobsen, Jeffrey Jay
• Primary Examiner(s): Lee, Michael G.
• Assistant Examiner(s): Nguyen, Kimberly D.
• Application Number:
  US09/932,515
• Time in Patent Office: 1,299 Days
• Field of Search: 235/492, 235/488, 235/489, 235/486, 235/487, 438/106, 438/107, 438/110, 438/455, 438/457, 156/665.1
• US Class Current: 235/492
• CPC Class Codes: G06K 19/077 Constructional details, e.g. mounting of circuits in the carrier
• CPC Class Codes: G06K 19/07703 the interface being visual
• CPC Class Codes: H01L 2224/95085 being a liquid, e.g. for fluidic self-assembly
• CPC Class Codes: H01L 2224/95101 in a liquid medium
• CPC Class Codes: H01L 2924/00 Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
• CPC Class Codes: H01L 2924/01079 Gold [Au]
• CPC Class Codes: H01L 2924/12041 LED
• CPC Class Codes: H01L 2924/12044 OLED
• CPC Class Codes: H01L 2924/13091 Metal-Oxide-Semiconductor Field-Effect Transistor [MOSFET]
• CPC Class Codes: H01L 2924/1461 MEMS
• CPC Class Codes: H01L 2924/15153 the die mounting substrate comprising a recess for hosting the device

Abstract

Apparatuses and methods for forming displays are claimed. One embodiment of the invention includes a contact smart card wherein fluidic self assembly is used to build the microelectronic structures on the display such that a contact smart data is transmitted unidirectionally. A contact smart card is inserted directly into a device that transfers data to a display coupled to the smart card. Another embodiment of the invention relates to a contactless smart card in which fluidic self assembly is also used here to build the display. Data is transmitted to an antenna that is embedded in the contactless card in which a plurality of blocks were deposited thereon.

Claims

1. A device comprising:

a first substrate coupled to a second substrate;

the first substrate comprising a plurality of display blocks which are deposited onto said first substrate and an integrated circuit coupled to the display blocks, each of said plurality of display blocks fabricated separately and then deposited onto recessed regions of said first substrate;

the integrated circuit, configured to receive a signal from an external source; and

less than or equal to two I/Os coupled to at least one display block and said integrated circuit.

2. The device of claim 1, wherein the second substrate comprises one of a flexible layer and a rigid layer.

3. The device of claim 1, wherein the integrated circuit comprises at least one driver block deposited onto the first substrate, wherein the driver block is coupled to at least one display block.

4. The device of claim 1, wherein each of said shaped display blocks comprises an active circuit element which drives a picture element.

5. The device of claim 1, wherein the first substrate comprises an active matrix backplane, the device further comprises:

a display generation substrate coupled to an active matrix backplane.

6. The device of claim 5, wherein the device has liquid crystal.

7. The device of claim 5, wherein the device has at least one OLED (Organic Light Emitting Diodes).

8. The device of claim 5, wherein said active matrix display is conformal.

9. The device of claim 1, wherein said first substrate has an active matrix backplane which comprises at least one electrode for each picture element.

10. The device of claim 1, wherein at least one of the first substrate and the second substrate is flexible.

11. An apparatus comprising:

at least one pixel block deposited onto a substrate, said at least one pixel block connected to a pixel element wherein said at least one pixel block is fabricated separately and then deposited onto a recessed region of said substrate;

at least one interface block deposited onto said substrate;

said at least one pixel block and said at least one interface block electrically coupled to form an active matrix backplane;

wherein said at least one pixel block having at least one integrated circuit thereon;

wherein data are transferable to said at least one integrated circuit.

12. The apparatus of claim 11 , wherein said at least one pixel block comprises an active circuit element which drives a picture element.

13. The apparatus of claim 11, further comprising:

a display generation substrate coupled to said active matrix backplane.

14. The apparatus of claim 11, wherein said active matrix display backplane comprises at least one electrode for each picture element.

15. The apparatus of claim 11, wherein said active matrix display panel is flexible and comprises a single crystal silicon transmissive display.

16. The apparatus of claim 11, wherein said active matrix display panel is flexible and comprises a single crystal silicon reflective display.

17. The apparatus of claim 11, wherein said active matrix display panel is flexible and comprises an organic light emitting diode.

18. The apparatus of claim 11, wherein said active matrix display panel is flexible and comprises upconverting phosphor.

19. A device comprising:

a first substrate;

a second substrate coupled to the first substrate;

the first substrate comprising a plurality of display blocks which are deposited onto said first substrate and an integrated circuit, said integrated circuit configured to receive a signal from an external source, each of said plurality of display blocks fabricated separately and then deposited onto recessed regions of said first substrate; and

less than or equal to four I/Os coupled to at least one display block and said integrated circuit.

20. A device comprising:

a first substrate;

a second substrate coupled to the first substrate;

the first substrate comprising a plurality of display blocks which are deposited onto said fast substrate and an integrated circuit, said integrated circuit configured to receive a signal from an external source, each of said plurality of display blocks fabricated separately and then deposited onto recessed regions of said first substrate; and

less than or equal to three I/Os coupled to at least one display block and a chip that transmit information.