Electrical contacts for flexible displays

• US 6,864,435 B2
• Filed: 04/23/2002
• Issued: 03/08/2005
• Est. Priority Date: 04/25/2001
• Status: Expired due to Term

• Current Assignee: RUIZHANG TECHNOLOGY LIMITED COMPANY
• Original Assignee: Alien Technology Corporation
• Inventors: Hermanns, Anno, Eisenhardt, Randolph W., Gengel, Glenn W.
• Primary Examiner(s): Cuneo, Kamand
• Assistant Examiner(s): DINH, TUAN T
• Application Number:
  US10/131,517
• Publication Number:
  US 20030155151A1
• Time in Patent Office: 1,050 Days
• Field of Search: 174254-258, 174260-264, 361736-737, 257/679, 257/693, 235/492, 349149-150
• US Class Current: 174/262
• CPC Class Codes: H01L 23/5387 Flexible insulating substrates H01L23/5388 takes precedence
• CPC Class Codes: H01L 2924/00 Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
• CPC Class Codes: H01L 2924/0002 Not covered by any one of groups H01L24/00, H01L24/00 and H01L2224/00
• CPC Class Codes: H01L 2924/12044 OLED
• CPC Class Codes: H01L 2924/3011 Impedance
• CPC Class Codes: H05K 3/0035 of blind holes, i.e. having a metal layer at the bottom
• CPC Class Codes: H05K 3/4038 Through-connections; Vertical interconnect access [VIA] connections H05K3/403, H05K3/42 take precedence
• CPC Class Codes: H10K 59/10 OLED displays
• CPC Class Codes: H10K 59/131 Interconnections, e.g. wiring lines or terminals
• CPC Class Codes: H10K 59/19 Segment displays

Abstract

A flexible electronic, Radio Frequency Identification (RF ID) or display device and methods of making the same. The flexible electronic, Radio Frequency Identification (RF ID) or display device comprises a flexible substrate having a top surface and a bottom surface. The top surface comprises electrical components. The flexible substrate comprises openings cutting therethrough from the top surface to the bottom surface. A conductive layer is coupled to the flexible substrate wherein the openings expose at least a portion of the conductive layer. The openings are filled with conductive elements to make first electrical contacts to at least a portion of the conductive layer and second electrical contacts to the electrical components on the flexible substrate.

Claims

1. A flexible display device comprising:

a flexible substrate having a top surface and a bottom surface, said top surface comprising electrical display components, said flexible substrate comprising openings cutting therethrough from said top surface to said bottom surface;

a conductive layer coupling to said bottom surface wherein said openings expose at least a portion of said conductive layer; and

conductive elements filling said openings to make first electrical contacts to at least a portion of said conductive layer and second electrical contacts to said electrical display components on said flexible substrate;

wherein said conductive layer constitutes at least 10% of a thickness of said flexible substrate.

2. A flexible display device comprising:

a flexible substrate comprising electrical display components, said flexible substrate having a top surface, said top surface having openings cutting therethrough;

a conductive layer disposed below said top surface wherein said openings exposing at least a portion of said conductive layer; and

conductive elements filling said openings to make first electrical contacts to at least a portion of said conductive layer and second electrical contacts to said electrical display components on said flexible substrate

wherein said conductive layer constitutes at least 10% of a thickness of said flexible substrate.

3. A flexible Radio Frequency Identification (RF ID) device comprising:

a flexible substrate having a top surface and a bottom surface, said top surface comprising electrical RF ID components, said flexible substrate comprising openings cutting therethrough from said top surface to said bottom surface;

a conductive layer coupling to said bottom surface wherein said openings expose at least a portion of said conductive layer; and

conductive elements filling said openings to make first electrical contacts to at least a portion of said conductive layer and second electrical contacts to said electrical RF ID components on said flexible substrate

wherein said conductive region is patterned to form a plurality of conductors from said conductive layer; and

wherein each of said openings is electrically coupled to at least one of said plurality of conductors;

wherein said electrical RF ID components comprise at least one integrated circuit. fabricated in a first rigid substrate and deposited onto a region of said flexible substrate;

wherein said conductive layer constitutes at least 10% of a thickness of said flexible substrate.

4. A flexible Radio Frequency Identification (RE ID) device comprising:

a flexible substrate comprising electrical RF ID components said flexible substrate having a top, surface, said top surface having openings cutting therethrough;

a conductive layer disposed below said top surface wherein said openings exposing at least a portion of said conductive layer; and

conductive elements filling said openings to make first electrical contacts to at least a portion of said conductive layer and second electrical contacts to said electrical RF ID components on said flexible substrate.

wherein said conductive layer constitutes at least 10% of a thickness of said flexible substrate.

5. A flexible electronic device comprising:

a flexible substrate having a top surface and a bottom surface, said top surface comprising electrical components, said flexible substrate comprising openings cutting therethrough from said top surface to said bottom surface;

said bottom surface comprising a conductive region wherein said openings exposing at least a portion of said conductive region; and

conductive elements filling said openings to make first electrical contacts to at least a portion of said conductive region and second electrical contacts to said electrical components on said flexible substrate;

wherein said conductive region is patterned to form a plurality of conductors from said conductive region; and

wherein each of said openings is electrically coupled to at least one of said plurality of conductors;

wherein said electrical components comprise at least one passive electronic component and at least one integrated circuit, fabricated in a first rigid substrate and deposited onto a region of said flexible substrate.

6. A flexible electronic device comprising:

a flexible substrate having a top surface and a bottom surface, said top surface comprising electrical components, said flexible substrate comprising openings cutting therethrough from said top surface to said bottom surface;

said bottom surface comprising a conductive region wherein said openings exposing at least a portion of said conductive region; and

conductive elements filling said openings to make first electrical contacts to at least a portion of said conductive region and second electrical contacts to said electrical components on said flexible substrate;

wherein said conductive region constitutes at least 10% of a thickness of said flexible substrate.

7. A flexible electronic device comprising:

a flexible substrate comprising electrical components, said flexible substrate having a top surface, said ton surface having openings cutting therethrough;

a conductive layer disposed below said top surface wherein said openings exposing at least a portion of said conductive layer; and

conductive elements filling said openings to make first electrical contacts to at least a portion of said conductive layer and second electrical contacts to said electrical components on said flexible substrate;

wherein said electrical components comprise at least one passive electronic component and at least one integrated circuit, fabricated in a first rigid substrate and deposited onto a region of said flexible substrate.

8. A flexible electronic device comprising:

a flexible substrate comprising electrical components, said flexible substrate having a top surface, said top surface having openings cutting therethrough;

a conductive layer disposed below said top surface wherein said openings exposing at least a portion of said conductive layer; and

conductive elements filling said openings to make first electrical contacts to at least a portion of said conductive layer and second electrical contacts to said electrical components on said flexible substrate;

wherein said conductive layer constitutes at least 10% of a thickness of said flexible substrate.