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Method and apparatus for fabricating self-assembling microstructures

  • US 6,864,570 B2
  • Filed: 06/08/2001
  • Issued: 03/08/2005
  • Est. Priority Date: 12/17/1993
  • Status: Expired due to Fees
First Claim
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1. A structure comprising an assemblage of separate electronic devices, each electronic device having a first surface and a second surface substantially parallel to said first surface, said electronic device further having a beveled side connecting said first surface to said second surface, said first surface having a smaller area than said second surface, said electronic device further having electronic structures formed on said second surface.

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