Two piece heat sink and device package

• US 6,864,573 B2
• Filed: 05/06/2003
• Issued: 03/08/2005
• Est. Priority Date: 05/06/2003
• Status: Active Grant

• Current Assignee: FCA US LLC (Stellantis NV)
• Original Assignee: Daimler Chrysler Corporation (Mercedes-Benz Group AG)
• Inventors: Brown, Gary L, Robertson, Michael F
• Primary Examiner(s): Thomas, Tom
• Assistant Examiner(s): Warren, Matthew E.
• Application Number:
  US10/430,555
• Publication Number:
  US 20040222517A1
• Time in Patent Office: 672 Days
• Field of Search: 257/718, 257/719, 257/722, 257/726, 257/727, 257/732, 361/730, 361/732, 361/759, 361/801, 361/802, 361/831
• US Class Current: 257/718
• CPC Class Codes: H01L 23/4093 Snap-on arrangements, e.g. clips
• CPC Class Codes: H01L 2924/00 Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
• CPC Class Codes: H01L 2924/0002 Not covered by any one of groups H01L24/00, H01L24/00 and H01L2224/00
• CPC Class Codes: H05K 7/20409 Outer radiating structures on heat dissipating housings, e.g. fins integrated with the housing

Abstract

A two piece electronic component heat sink and device package comprising a first piece configured to retain electronic components, and a second piece having a hinge region configured to moveably connect the second piece to the first piece, and a snap lock region opposite the hinge region, the snap lock region configured to secure the second piece to the first piece. A two piece electronic component heat sink and device package for a circuit board comprising: a first piece having an index slot for retaining said circuit board, and a second piece having a hinge region configured to pivotably connect the second piece and the first piece, and a snap lock region configured to secure the second piece to the first piece.

Claims

1. A two piece electronic component heat sink and device package comprising:

a first piece configured to retain electronic components and having projections for creating a region, and

a second piece having

a hinge region with a T-shaped projection, where said region of said first piece entraps said T-shaped projection of said second piece and thereby pivotably connects said second piece and said first piece, and

a snap lock region configured to secure said second piece to said first piece.

2. The two piece electronic component heat sink and device package described in claim 1, where said first piece is configured to retain and connect said electronic components.

3. The two piece electronic component heat sink and device package described in claim 1, where said first piece incorporates a connector configured to removeably connect and retain said electronic components.

4. The two piece electronic component heat sink and device package described in claim 1, where said second piece is biased relative to said first piece to permit said second piece to pivot at said hinge region and be moveably positioned relative to said first piece.

5. The two piece electronic component heat sink and device package described in claim 1, where said hinge region comprises an integral hinge.

6. The two piece electronic component heat sink and device package described in claim 1, where said snap lock region comprises an integral snap lock.

7. The two piece electronic component heat sink and device package described in claim 1, where said first piece and said second piece are configured to enclose and encapsulate said electronic components.

8. The two piece electronic component heat sink and device package described in claim 1, where said first piece and said second piece are fabricated with fins.

9. A two piece electronic component heat sink and device package for a circuit board comprising:

a first piece having an index slot for retaining said circuit board and having projections for creating a region, and

a second piece having

a hinge region with a T-shaped projection, where said region entraps said T-shaped projection and thereby pivotably connects said second piece and said first piece, and

a snap lock region configured to secure said second piece to said first piece.

10. The two piece electronic component heat sink and device package described in claim 9, where said first piece further comprises support tabs for said circuit board.

11. The two piece electronic component heat sink and device package described in claim 9, where said first piece incorporates a connector configured to removeably connect and retain said circuit board when said circuit board is properly positioned in said index slot.

12. The two piece electronic component heat sink and device package described in claim 9, where said second piece is biased against said first piece to permit said second piece to pivot at said hinge region and be moveably positioned relative to said first piece.

13. The two piece electronic component heat sink and device package described in claim 9, further comprising a spring clip attached to said second piece and positioned to urge said circuit board into said index slot as said second piece is pivoted at said hinge region to engage said first piece at said second region.

14. The two piece electronic component heat sink and device package described in claim 9, further comprising a spring clip attached to said second piece and positioned to urge said circuit board into said index slot and into a connector integrated into said first piece as said second piece is pivoted at said hinge region to engage said second piece with said first piece at said second region.

15. The two piece electronic component heat sink and device package described in claim 9, where said hinge region is an integral hinge.

16. The two piece electronic component heat sink and device package described in claim 9, where said snap lock region is an integral snap lock.

17. The two piece electronic component heat sink and device package described in claim 9, where said first piece and said second piece are configured to encapsulate said circuit board.

18. The two piece electronic component heat sink and device package described in claim 9, where said first piece and said second piece are finned.