Electrophoretic display and novel process for its manufacture

• US 6,865,012 B2
• Filed: 03/29/2004
• Issued: 03/08/2005
• Est. Priority Date: 03/03/2000
• Status: Expired due to Fees

• Current Assignee: E Ink California, LLC (E Ink Corporation)
• Original Assignee: SiPix Imaging, Inc. (E Ink Holdings Incorporated)
• Inventors: Wu, Zarng-Arh George, Liang, Rong-Chang, Zang, Hong Mei, Tseng, Scott C-J
• Primary Examiner(s): Epps, Georgia
• Assistant Examiner(s): Dinh, Jack
• Application Number:
  US10/812,697
• Publication Number:
  US 20040246561A1
• Time in Patent Office: 344 Days
• Field of Search: 359/296, 359/254, 359/316, 345/107, 345/108, 345/111, 430/35, 252/572, 204/488
• US Class Current: 359/296
• CPC Class Codes: G02F 1/133305 Flexible substrates, e.g. plastics, organic film
• CPC Class Codes: G02F 1/133377 Cells with plural compartments or having plurality of liquid crystal microcells partitioned by walls, e.g. one microcell per pixel
• CPC Class Codes: G02F 1/1339 Gaskets; Spacers; Sealing of cells
• CPC Class Codes: G02F 1/167 by electrophoresis
• CPC Class Codes: G02F 1/1681 having two or more microcells partitioned by walls, e.g. of microcup type

Abstract

This invention relates to an electrophoretic display comprising cells of well-defined shape, size and aspect ratio which cells are filled with charged pigment particles dispersed in a solvent, and novel processes for its manufacture.

Claims

1. A process for the manufacture of an electrophoretic display, which process comprises:

a) forming microcups on a first non-conducting substrate wherein said microcups have side surface and bottom surface and are separated by partition walls having top surface;

b) forming a first conductive layer on the side surface and the bottom surface of the microcups and the otp surface of the partition walls;

c) filling the microcups with an electrophoretic fluid;

d) sealing the filled microcups; and

e) forming a second conductive layer over the filled and sealed microcups.

2. The process of claim 1 wherein said microcups are formed by microembossing a thermoplastic or thermoset precursor with a male mold, imagewise exposing a radiation curable material or applying a spacer film having prepunched holes.

3. The process of claim 1 wherein said first conductive layer is formed by thin film deposition.

4. The process of claim 3 wherein said thin film deposition is sputtering or vapor deposition.

5. The process of claim 1 wherein the sealing is accomplished by a sealing composition having a specific gravity lower than that of the electrophoretic fluid.

6. The process of claim 5 wherein said filling and sealing are accomplished by filling a mixture of the electrophoretic fluid and the sealing composition and hardening the sealing composition during or after it phase separates and forms a supernatant layer above the electrophoretic fluid.

7. The process of claim 5 wherein said sealing is accomplished by overcoating the sealing composition on the electrophoretic fluid and hardening the sealing composition.

8. The process of claim 5 wherein said sealing composition is a radiation, heat or moisture curable composition.

9. The process of claim 5 wherein said sealing composition comprises a thermoplastic or thermoset precursor.

10. The process of claim 9 wherein said thermoplastic or thermoset precursor is selected from the group consisting of hydrocarbon rubbers, butadiene rubbers, isoprene rubbers, thermoplastic elastomers, polyvalent acrylates, polyvalent methacrylates, cyanoacrylates, polyvalent vinyls, polyvalent epoxides, polyvalent isocyanates, polyvalent allyls and oligomers and polymers containing crosslinkable functional groups.

11. The process of claim 1 wherein said second conductive layer is formed by thin film deposition or lamination.

12. The process of claim 1 further laminating a second non-conducting substrate over the second conductive layer.

13. The process of claim 1 further comprising forming a third conductive layer between the first non-conducting substrate and the microcups.

14. The process of claim 13 wherein said third conductive layer is formed by thin film deposition or lamination on the first non-conducting substrate.