Flexible circuit board

• US 6,866,368 B2
• Filed: 03/28/2003
• Issued: 03/15/2005
• Est. Priority Date: 04/25/2001
• Status: Active Grant

• Current Assignee: 92104 LLC (Ni, Wang & Massand, PLLC)
• Original Assignee: BenQ Corporation (Qisda Corporation)
• Inventors: Chen, Chih-Ching, Peng, Ming-Chung, Leu, Yi-Jing
• Primary Examiner(s): Meier, Stephen D.
• Assistant Examiner(s): DUDDING, ALFRED E
• Application Number:
  US10/400,457
• Publication Number:
  US 20030159851A1
• Time in Patent Office: 718 Days
• Field of Search: 347/50, 361/750, 174/254, 298/30, 298/31, 298/40, 298/46, 298/84, 298/801
• US Class Current: 347/50
• CPC Class Codes: B41J 2/14 Structure thereof only for on-demand ink jet heads
• CPC Class Codes: B41J 2/16 Production of nozzles
• CPC Class Codes: B41J 2/1623 bonding and adhesion
• CPC Class Codes: B41J 2/1631 photolithography
• CPC Class Codes: B41J 2/164 thin film formation
• CPC Class Codes: B41J 2002/14491 Electrical connection
• CPC Class Codes: H05K 1/0393 Flexible materials H05K1/038 takes precedence; specific organic compositions are classified in H05K1/0313 and subgroups
• CPC Class Codes: H05K 2201/09881 Coating only between conductors, i.e. flush with the conductors
• CPC Class Codes: H05K 3/0023 by exposure and development of a photosensitive insulating layer
• CPC Class Codes: H05K 3/28 Applying non-metallic protective coatings H05K3/0091 takes precedence; methods for intermediate insulating layers for build-up multilayer circuits H05K3/4673
• CPC Class Codes: H05K 3/386 by the use of an organic polymeric bonding layer, e.g. adhesive
• CPC Class Codes: Y10T 29/49126 Assembling bases
• CPC Class Codes: Y10T 29/49128 Assembling formed circuit to base
• CPC Class Codes: Y10T 29/49144 by metal fusion
• CPC Class Codes: Y10T 29/49155 Manufacturing circuit on or in base
• CPC Class Codes: Y10T 29/49222 forming array of contacts or terminals
• CPC Class Codes: Y10T 29/49401 Fluid pattern dispersing device making, e.g., ink jet

Abstract

A process of forming a flexible circuit board for ink jetting is provided. The process includes the steps of: providing an insulation tape; forming conductive traces on the insulation tape; and forming a photo-polymer layer filling between the conductive traces, wherein parts of the conductive traces are exposed to form a plurality of contacts. The material of the insulation tape can be polyimide, Teflon, polyamide, polymethylmethacrylate, polycarbonate, polyester, polyamide polyethylene-terephthalate copolymer, or any combination of the above materials. The material of the photo-polymer layer can be solder mask or polyimide.

Claims

1. A flexible circuit board for ink jetting, comprising:

an insulation tape as a substrate;

conductive traces on the insulation tape; and

a photo-polymer layer filling between the conductive traces, wherein parts of the conductive traces are exposed to form a plurality of contacts.

2. The flexible circuit board according to claim 1, wherein the insulation tape comprises a polymer film.

3. The flexible circuit board according to claim 2, wherein the material of the polymer film comprising at least one of polyimide (PI), Teflon, polyamide, polymethyl methacrylate, polycarbonate, polyester, and polyamide polyethylene-terephthalate copolymer.

4. The flexible circuit board according to claim 1, wherein the material of the photo-polymer layer is solder mask.

5. The flexible circuit board according to claim 1, wherein the photo-polymer layer is made of solder mask and the solder mask comprises a main agent and a hardener with a ratio of about 7:

3.

6. The flexible circuit board according to claim 1, wherein a material of the photo-polymer layer is polyimide.

7. The flexible circuit board according to claim 1, wherein a material of the conductive traces is copper.

8. The flexible circuit board according to claim 1, wherein a material of the conductive traces is gold.

9. The flexible circuit board according to claim 1, wherein a thickness of the conductive traces is about 10 μ

m to 50 μ

m.