Semiconductor device having improved alignment of an electrode terminal on a semiconductor chip and a conductor coupled to the electrode terminal

• US 6,867,478 B2
• Filed: 04/10/2003
• Issued: 03/15/2005
• Est. Priority Date: 02/04/2000
• Status: Expired due to Fees

• Current Assignee: Hitachi, Ltd.
• Original Assignee: Hitachi, Ltd.
• Inventors: Usami, Mitsuo
• Primary Examiner(s): Whitehead, Jr., Carl
• Assistant Examiner(s): BEREZNY, NEMA O
• Application Number:
  US10/410,175
• Publication Number:
  US 20030201522A1
• Time in Patent Office: 705 Days
• Field of Search: 257/601, 257/577, 257/910, 257/773, 438/666
• US Class Current: 257/601
• CPC Class Codes: G06K 19/07745 Mounting details of integrated circuit chips
• CPC Class Codes: G06K 19/07749 the record carrier being capable of non-contact communication, e.g. constructional details of the antenna of a non-contact smart card
• CPC Class Codes: G06K 19/0775 arrangements for connecting the integrated circuit to the antenna
• CPC Class Codes: G06K 19/07779 the inductive antenna being a coil
• CPC Class Codes: G06K 19/07786 the antenna being of the HF type, such as a dipole
• CPC Class Codes: H01L 21/6835 using temporarily an auxiliary support
• CPC Class Codes: H01L 2221/68354 used to support diced chips prior to mounting
• CPC Class Codes: H01L 2221/68368 used in a transfer process involving at least two transfer steps, i.e. including an intermediate handle substrate
• CPC Class Codes: H01L 2224/83191 wherein the layer connectors are disposed only on the semiconductor or solid-state body
• CPC Class Codes: H01L 23/49838 Geometry or layout
• CPC Class Codes: H01L 23/49855 for flat-cards, e.g. credit cards cards per se G06K19/00
• CPC Class Codes: H01L 2924/00 Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
• CPC Class Codes: H01L 2924/01019 Potassium [K]
• CPC Class Codes: H01L 2924/07811 Extrinsic, i.e. with electrical conductive fillers
• CPC Class Codes: H01L 2924/19041 being a capacitor
• CPC Class Codes: Y10S 257/91 Diode arrays, e.g. diode read-only memory array
• CPC Class Codes: Y10S 438/928 Front and rear surface processing

Abstract

A semiconductor device manufacturing method is used for packaging a thin semiconductor chip in an economical manner. A semiconductor chip having one electrode terminal, a first member having a first conductor on its surface, and a second member having a second conductor on its surface are prepared. The first and second members are positioned such that the first and second conductors face each other, and the semiconductor chip is held between the members. In this arrangement, one of the first and second conductors is in electrical contact with the first electrode.

Claims

1. A communication device comprising:

a first electrode;

a second electrode;

a semiconductor chip having an inner circuit and a rectifier diode and an input diode;

a third electrode on a major surface of said semiconductor chip;

a fourth electrode on a surface of said semiconductor chip which is opposite, said major surface,

wherein said fourth electrode is coupled to said second electrode; and

an oxide film formed between said first electrode and said third electrode on the major surface of semiconductor chip;

wherein said third electrode is coupled to a cathode of said rectifier diode and an anode of said input diode,

wherein an anode of said rectifier diode is electrically coupled to said fourth electrode, and

wherein a cathode of said input diode is coupled to the inner circuit of said semiconductor chip.

2. The communication device according to claim 1, wherein said input diode and said rectifier diode and inner circuit are formed on said major surface, and

wherein a voltage of said fourth electrode is a substrate voltage of said semiconductor chip.

3. The communication device according to claim 2;

wherein said first electrode and said second electrode are antennae.

4. The communication device according to claim 1

wherein said first electrode and said second electrode are antennae.

5. The communication device according to claim 1;

wherein said first electrode is attached to said oxide film by adhesive.

6. The communication device according to claim 1

further comprising a first sheet and a second sheet,

wherein said first electrode is formed on said first sheet, and

wherein said second electrode is formed on said second sheet.

7. A communication device comprising:

a first electrode;

a second electrode;

a semiconductor chip having an inner circuit and a double voltage rectifier circuit including a rectifier diode, an input diode and a capacitor;

a third electrode on a major surface of said semiconductor chip;

a fourth electrode on a surface of said semiconductor chip which is opposite, said major surface,

wherein said fourth electrode is coupled to said second electrode; and

an oxide film formed between said first electrode and said third electrode on the major surface of semiconductor chip to form said capacitor;

wherein said third electrode is coupled to a cathode of said rectifier diode and an anode of said input diode,

wherein an anode of said rectifier diode is electrically coupled to said fourth electrode,

wherein a cathode of said input diode is coupled to the inner circuit of said semiconductor chip, and

wherein the double voltage rectifier circuit rectifies an AC voltage received by said first electrode and provides a double DC voltage from the cathode of said input diode to said inner circuit of said semiconductor chip.

8. The communication device according to claim 7, wherein said input diode and said rectifier diode and inner circuit are formed on said major surface, and

wherein a voltage of said fourth electrode is a substrate voltage of said semiconductor chip.

9. The communication device according to claim 8;

wherein said first electrode and said second electrode are antennae.

10. The communication device according to claim 7;

wherein said first electrode and said second electrode are antennae.

11. The communication device according to claim 7;

wherein said first electrode is attached to said oxide film by adhesive.

12. The communication device according to claim 7;

further comprising a first sheet and a second sheet,

wherein said first electrode is formed on said first sheet, and

wherein said second electrode is formed on said second sheet.