Structure and method for fabrication of a leadless multi-die carrier

• US 6,867,493 B2
• Filed: 06/28/2001
• Issued: 03/15/2005
• Est. Priority Date: 11/15/2000
• Status: Expired due to Term

• Current Assignee: Skyworks Solutions Incorporated
• Original Assignee: Skyworks Solutions Incorporated
• Inventors: Cote, Kevin J., Hashemi, Hassan S.
• Primary Examiner(s): Zarneke, David A.
• Application Number:
  US09/894,728
• Publication Number:
  US 20020149102A1
• Time in Patent Office: 1,356 Days
• Field of Search: 257/706, 257/707, 257/712, 257/713, 361/719, 361/718, 361/717, 361/720
• US Class Current: 257/717
• CPC Class Codes: H01L 2224/05554 being square
• CPC Class Codes: H01L 2224/16237 the bump connector connecting to a bonding area disposed in a recess of the surface of the item
• CPC Class Codes: H01L 2224/32225 the item being non-metallic, e.g. insulating substrate with or without metallisation
• CPC Class Codes: H01L 2224/45015 being circular
• CPC Class Codes: H01L 2224/45124 Aluminium (Al) as principal constituent
• CPC Class Codes: H01L 2224/45144 Gold (Au) as principal constituent
• CPC Class Codes: H01L 2224/48091 Arched
• CPC Class Codes: H01L 2224/48137 the bodies being arranged next to each other, e.g. on a common substrate
• CPC Class Codes: H01L 2224/48227 connecting the wire to a bond pad of the item
• CPC Class Codes: H01L 2224/48228 the bond pad being disposed in a recess of the surface of the item
• CPC Class Codes: H01L 2224/48237 connecting the wire to a die pad of the item
• CPC Class Codes: H01L 2224/49171 Fan-out arrangements
• CPC Class Codes: H01L 2224/73265 Layer and wire connectors
• CPC Class Codes: H01L 23/3677 Wire-like or pin-like cooling fins or heat sinks
• CPC Class Codes: H01L 23/49827 Via connections through the substrates, e.g. pins going through the substrate, coaxial cables H01L23/49822, H01L23/49833, H01L23/4985, H01L23/49861 take precedence
• CPC Class Codes: H01L 23/49838 Geometry or layout
• CPC Class Codes: H01L 23/645 Inductive arrangements H01L23/647, H01L23/66 take precedence
• CPC Class Codes: H01L 24/45 of an individual wire connector
• CPC Class Codes: H01L 24/48 of an individual wire connector
• CPC Class Codes: H01L 24/49 of a plurality of wire connectors
• CPC Class Codes: H01L 24/73 : Means for bonding being of different types provided for in two or more of groups H01L24/10, H01L24/18, H01L24/26, H01L24/34, H01L24/42, H01L24/50, H01L24/63, H01L24/71
• CPC Class Codes: H01L 25/0655 : the devices being arranged next to each other
• CPC Class Codes: H01L 2924/00 : Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
• CPC Class Codes: H01L 2924/00012 : Relevant to the scope of the group, the symbol of which is combined with the symbol of this group
• CPC Class Codes: H01L 2924/00014 : the subject-matter covered by the group, the symbol of which is combined with the symbol of this group, being disclosed without further technical details
• CPC Class Codes: H01L 2924/01004 : Beryllium [Be]
• CPC Class Codes: H01L 2924/01005 : Boron [B]
• CPC Class Codes: H01L 2924/01006 : Carbon [C]
• CPC Class Codes: H01L 2924/01013 : Aluminum [Al]
• CPC Class Codes: H01L 2924/01028 : Nickel [Ni]
• CPC Class Codes: H01L 2924/01029 : Copper [Cu]
• CPC Class Codes: H01L 2924/01039 : Yttrium [Y]
• CPC Class Codes: H01L 2924/01042 : Molybdenum [Mo]
• CPC Class Codes: H01L 2924/01047 : Silver [Ag]
• CPC Class Codes: H01L 2924/01058 : Cerium [Ce]
• CPC Class Codes: H01L 2924/01074 : Tungsten [W]
• CPC Class Codes: H01L 2924/01078 : Platinum [Pt]
• CPC Class Codes: H01L 2924/01079 : Gold [Au]
• CPC Class Codes: H01L 2924/014 : Solder alloys
• CPC Class Codes: H01L 2924/09701 : Low temperature co-fired ceramic [LTCC]
• CPC Class Codes: H01L 2924/10162 : with a square active surface
• CPC Class Codes: H01L 2924/14 : Integrated circuits
• CPC Class Codes: H01L 2924/15313 : being a land array, e.g. LGA
• CPC Class Codes: H01L 2924/15747 : Copper [Cu] as principal constituent
• CPC Class Codes: H01L 2924/15787 : Ceramics, e.g. crystalline carbides, nitrides or oxides
• CPC Class Codes: H01L 2924/181 : Encapsulation
• CPC Class Codes: H01L 2924/19042 : being an inductor
• CPC Class Codes: H01L 2924/20753 : larger or equal to 30 microns less than 40 microns
• CPC Class Codes: H01L 2924/30105 : Capacitance
• CPC Class Codes: H01L 2924/30107 : Inductance
• CPC Class Codes: H01L 2924/3011 : Impedance
• CPC Class Codes: H01L 2924/3025 : Electromagnetic shielding
• CPC Class Codes: H01L 2924/351 : Thermal stress

Abstract

One disclosed embodiment comprises a substrate having a top surface for receiving two or more semiconductor dies. The disclosed embodiment further comprises a printed circuit board attached to a bottom surface of the substrate and at least one via in the substrate. The at least one via provides an electrical connection between a signal bond pad of a first semiconductor die and the printed circuit board. The at least one via provides an electrical connection between a first substrate bond pad and the printed circuit board. The first substrate bond pad is connected to the first signal bond pad of the first semiconductor die by a first signal bonding wire. The at least one via also provides an electrical connection between the first signal bond pad of the first semiconductor die and a first land that is electrically connected to the printed circuit board.

Claims

1. A structure comprising:

a substrate having a top surface and a bottom surface;

a first semiconductor die and a second semiconductor die attached to said top surface of said substrate, wherein said first semiconductor die is coupled both to said second semiconductor die and to said substrate;

a first heat spreader and a second heat spreader attached to said bottom surface of said substrate;

a first via and a second via in said substrate;

said first via providing a connection between said first semiconductor die and said first heat spreader, said second via providing a connection between said second semiconductor die and said second heat spreader.

2. The structure of claim 1 wherein said first and second heat spreaders are attached to a printed circuit board.

3. The structure of claim 1 further comprising a first substrate down bond area attached to said top surface of said substrate, wherein said first via provides an electrical connection between said first substrate down bond area and said first heat spreader.

4. The structure of claim 3 wherein a first semiconductor die ground bond pad on said first semiconductor die is electrically connected to said first substrate down bond area by a first down bonding wire.

5. The structure of claim 1 wherein a third via in said substrate provides a connection between a first signal bond pad of said first semiconductor die and a printed circuit board.

6. The structure of claim 1 wherein said substrate comprises organic material.

7. The structure of claim 6 wherein said organic material is selected from the group consisting of polytetrafluoroethylene material and an FR4 based laminate material.

8. The structure of claim 1 wherein said substrate comprises a ceramic material.

9. The structure of claim 5 wherein said third via provides an electrical connection between a first substrate bond pad and said printed circuit board, wherein said first substrate bond pad is electrically connected to said first signal bond pad of said first semiconductor die.

10. The structure of claim 9 wherein said first substrate bond pad overlaps said third via.

11. The structure of claim 9 wherein said first substrate bond pad is electrically connected to said first signal bond pad of said first semiconductor die by a first signal bonding wire.

12. The structure of claim 5 wherein said third via provides an electrical connection between said first signal bond pad of said first semiconductor die and a first land, said first land being electrically connected to said printed circuit board.

13. The structure of claim 12 wherein said third via overlaps said land.

14. A structure comprising:

a substrate having a top surface and a bottom surface;

a first semiconductor die and a second semiconductor die attached to said top surface of said substrate, wherein said first semiconductor die is coupled both to said second semiconductor die and to said substrate;

a heat spreader attached to said bottom surface of said substrate;

a first via and a second via in said substrate;

said first via providing a connection between said first semiconductor die and said heat spreader, said second via providing a connection between said second semiconductor die and said heat spreader.

15. The structure of claim 14 wherein said heat spreader is attached to a printed circuit board.

16. The structure of claim 14 further comprising a first substrate down bond area attached to said top surface of said substrate, wherein said first via provides an electrical connection between said first substrate down bond area and said heat spreader.

17. The structure of claim 16 wherein a first semiconductor die ground bond pad on said first semiconductor die is electrically connected to said first substrate down bond area by a first down bonding wire.

18. The structure of claim 14 wherein a third via in said substrate provides a connection between a first signal bond pad of said first semiconductor die and a printed circuit board.

19. The structure of claim 18 wherein said third via provides an electrical connection between a first substrate bond pad and said printed circuit board, wherein said first substrate bond pad is electrically connected to said first signal bond pad of said first semiconductor die.

20. The structure of claim 19 wherein said first substrate bond pad overlaps said third via.

21. The structure of claim 19 wherein said first substrate bond pad is electrically connected to said first signal bond pad of said first semiconductor die by a first signal bonding wire.

22. The structure of claim 18 wherein said third via provides an electrical connection between said first signal bond pad of said first semiconductor die and a first land, said first land being electrically connected to said printed circuit board.

23. The structure of claim 22 wherein said third via overlaps said land.