Mask and projection exposure apparatus
First Claim
Patent Images
1. A projection exposure apparatus comprising;
- i) a mask stage for installing a mask, the mask including;
a) a substrate that has a pattern on one surface of the substrate b) a transparent member provided at the side of the one surface of the substrate; and
c) a thin film that is adhered to said transparent member, and has an aspheric surface;
ii) an illumination optical system for illuminating the mask; and
iii) a projection optical system for projecting the pattern on the mask illuminated by said illumination optical system, said mask stage and said illumination and projection optical systems being configured such that the pattern on the mask may be projected.
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Accused Products
Abstract
There is to provide a mask including a transparent member at a side of a surface of a base, a pattern being formed on the surface, and a correction part for correcting a change in an optical path of the transparent member.
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Citations
18 Claims
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1. A projection exposure apparatus comprising;
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i) a mask stage for installing a mask, the mask including;
a) a substrate that has a pattern on one surface of the substrate b) a transparent member provided at the side of the one surface of the substrate; and
c) a thin film that is adhered to said transparent member, and has an aspheric surface;
ii) an illumination optical system for illuminating the mask; and
iii) a projection optical system for projecting the pattern on the mask illuminated by said illumination optical system, said mask stage and said illumination and projection optical systems being configured such that the pattern on the mask may be projected. - View Dependent Claims (2, 3, 4, 5, 6, 7, 8, 9, 10, 11)
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12. A projection exposure apparatus comprising a projection optical system for projecting, onto an object to be exposed, a pattern formed on a surface of a mask that includes, at a side of the surface, a transparent member and a correction part for reducing an error of an image of the pattern projected on the object caused by errors in the pattern, and
wherein said correction part includes a thin film that is adhered to said transparent member, and has an aspheric surface.
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13. A projection exposure apparatus comprising a projection optical system for projecting, onto an object to be exposed, a pattern formed on a surface of a mask that includes, at a side of the surface, a transparent member and a correction part that has an aspheric surface for reducing a fluctuation of an optical path of light from the pattern to the object, the fluctuation being caused by a deformation of the transparent member, and
wherein said correction part includes a thin film that is adhered to said transparent member, and has an aspheric surface.
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14. A projection exposure apparatus comprising a projection optical system for projecting, onto an object to be exposed, a pattern formed on a surface of a mask that includes, at a side of the surface, a transparent member and a correction part that has an aspheric surface at least one of incident and exit planes, the aspheric surface for reducing an error of an image of the pattern projected on the object caused by errors in the pattern and/or for reducing a fluctuation of an optical path of light from the pattern to the object, the fluctuation being caused by a deformation of the transparent member, and
wherein said correction part includes a thin film that is adhered to said transparent member, and has an aspheric surface.
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15. A device fabrication method comprising the steps of:
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projecting a pattern on a mask onto a wafer by using a projection exposure apparatus; and
developing said wafer to which said pattern was transferred;
wherein said projection exposure apparatus includes;
a mask stage for installing the mask, the mask including a substrate that has a pattern on one surface of the substrate, a transparent member provided at the side of the one surface of the substrate, and a thin film that is adhered to said transparent member, and has an aspheric surface;
an illumination optical system for illuminating the mask; and
a projection optical system for projecting the pattern on the mask illuminated by said illumination optical system, said mask stage and said illumination and projection optical systems being configured such that the pattern on the mask may be projected.
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16. A device fabrication method comprising the steps of:
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projecting a pattern on a mask onto a wafer by using a projection exposure apparatus; and
developing said wafer to which said pattern was transferred;
wherein said projection exposure apparatus includes a projection optical system for projecting, onto an object to be exposed, a pattern formed on a surface of a mask that includes, at a side of the surface, a transparent member and a correction part for reducing an error of an image of the pattern projected on the object caused by errors in the pattern, and wherein said correction part includes a thin film that is adhered to said transparent member, and has an aspheric surface.
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17. A device fabrication method comprising the steps of:
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projecting a pattern on a mask onto a wafer by using a projection exposure apparatus; and
developing said wafer to which said pattern was transferred;
wherein said projection exposure apparatus includes a projection optical system for projecting, onto an object to be exposed, a pattern formed on a surface of a mask that includes, at a side of the surface, a transparent member and a correction part that has an aspheric surface for reducing a fluctuation of an optical path of light from the pattern to the object, the fluctuation being caused by a deformation of the transparent member, and wherein said correction part includes a thin film that is adhered to said transparent member and, has an aspheric surface.
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18. A device fabrication method comprising the steps of:
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projecting a pattern on a mask onto a wafer by using a projection exposure apparatus; and
developing said wafer to which said pattern was transferred;
wherein said projection exposure apparatus includes a projection optical system for projecting, onto an object to be exposed, a pattern formed on a surface of a mask that includes, at a side of the surface, a transparent member and a correction part that has an aspheric surface at least one of incident and exit planes, the aspheric surface for reducing an error of an image of the pattern projected on the object caused by errors in the pattern and/or for reducing a fluctuation of an optical path of light from the pattern to the object, the fluctuation being caused by a deformation of the transparent member, and wherein said correction part includes a thin film that is adhered to said transparent member, and has an aspheric surface.
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Specification