Alignment and orientation features for a semiconductor package
First Claim
1. A method of electrically connecting a first plurality of bonding pads of a semiconductor die to a second plurality of bonding pads located on lead fingers of a lead frame of a semiconductor device, the method comprising:
- storing data indicative of (i) the shape and location of at least one eyepoint features of a lead paddle of an exemplary lead frame adapted to receive a semiconductor die (ii) the relative location between the at least one eyepoint feature of the lead paddle and the first plurality of bonding pads of a semiconductor die positioned on the exemplary lead frame and (iii) the relative location of a second plurality of bonding pads from the at least one eyepoint feature;
obtaining an image of a second lead frame corresponding to the exemplary lead frame;
identifying the location of at least one eyepoint feature formed on a die paddle of the second lead frame adapted to receive the semiconductor die wherein the location of at least one eyepoint feature is determined through pattern recognition of the obtained image of the second lead frame to recognize an edge of the at least one eyepoint image and then matching the recognized edge of the at least one eyepoint image to the corresponding edge of the eyepoint image of the exemplary lead frame to determine the position of the at least one eyepoint feature;
determining the relative locations of the first and second plurality of bonding pads from the position of the eyepoint feature located on the die paddle of the lead frame by using the stored data indicative of the relative positions between the eyepoint feature of the lead paddle and the first plurality of bonding pads and the second plurality of bonding pads from the exemplary lead frame; and
;
directing a wire bonding device to form wire bonds between the first and second pluralities of bonding pads using the determined relative locations of the second plurality of bonding pads.
5 Assignments
0 Petitions
Accused Products
Abstract
A semiconductor device formed by an automated wire bonding system. The semiconductor device comprises a lead frame having a plurality of lead fingers and a die paddle, and a semiconductor die mounted to the die paddle. The die paddle comprises a plurality of eyepoint features that extend from the die. The die comprises a first plurality of bonding pads and the lead fingers comprise a second plurality of bonding pads. The first and second bonding pads are interconnected by a plurality of connecting wires which are installed by the automated wire bonding system. The wire bonding system obtains an image of the lead frame and identifies the eyepoint features of the die paddle within the image so as to more accurately determine the positions of the second wire bonding pads of the lead frame with respect to the wire bonding system.
19 Citations
8 Claims
-
1. A method of electrically connecting a first plurality of bonding pads of a semiconductor die to a second plurality of bonding pads located on lead fingers of a lead frame of a semiconductor device, the method comprising:
-
storing data indicative of (i) the shape and location of at least one eyepoint features of a lead paddle of an exemplary lead frame adapted to receive a semiconductor die (ii) the relative location between the at least one eyepoint feature of the lead paddle and the first plurality of bonding pads of a semiconductor die positioned on the exemplary lead frame and (iii) the relative location of a second plurality of bonding pads from the at least one eyepoint feature;
obtaining an image of a second lead frame corresponding to the exemplary lead frame;
identifying the location of at least one eyepoint feature formed on a die paddle of the second lead frame adapted to receive the semiconductor die wherein the location of at least one eyepoint feature is determined through pattern recognition of the obtained image of the second lead frame to recognize an edge of the at least one eyepoint image and then matching the recognized edge of the at least one eyepoint image to the corresponding edge of the eyepoint image of the exemplary lead frame to determine the position of the at least one eyepoint feature;
determining the relative locations of the first and second plurality of bonding pads from the position of the eyepoint feature located on the die paddle of the lead frame by using the stored data indicative of the relative positions between the eyepoint feature of the lead paddle and the first plurality of bonding pads and the second plurality of bonding pads from the exemplary lead frame; and
;
directing a wire bonding device to form wire bonds between the first and second pluralities of bonding pads using the determined relative locations of the second plurality of bonding pads. - View Dependent Claims (2, 3, 4, 5, 6, 7, 8)
-
Specification