Power semiconductor device

• US 6,870,253 B1
• Filed: 03/03/2004
• Issued: 03/22/2005
• Est. Priority Date: 09/05/2003
• Status: Expired due to Term

• Current Assignee: Mitsubishi Denki Kabushiki Kaisha (Mitsubishi Electric Corporation)
• Original Assignee: Mitsubishi Denki Kabushiki Kaisha (Mitsubishi Electric Corporation), Renesas Device Design Corp. (Renesas Electronics Corporation)
• Inventors: Ushijima, Koichi
• Primary Examiner(s): Lee, Eddie
• Assistant Examiner(s): Owens, Douglas W.
• Application Number:
  US10/790,705
• Publication Number:
  US 20050051874A1
• Time in Patent Office: 384 Days
• Field of Search: 257/691, 257/578, 361/611, 361/624, 361/637, 361/639
• US Class Current: 257/691
• CPC Class Codes: H01L 25/115 the devices being arranged next to each other
• CPC Class Codes: H01L 2924/00 Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
• CPC Class Codes: H01L 2924/0002 Not covered by any one of groups H01L24/00, H01L24/00 and H01L2224/00

Abstract

Emitter electrodes (Es) and collector electrodes (Cs) of elements (101 to 104) are connected to bus electrodes (361 to 364) of a bus bar (351), respectively. The bus bar (351) contains seven layers including four insulating layers (not shown) and three conductive layers (shown) interposed between the insulating layers. Namely, each of the bus electrodes (361 to 364) is connected to one of the conductive layers corresponding to one of a positive electrode (P), a negative electrode (N) and an intermediate electrode (L). The collector electrodes (Cs) of the elements (103 and 104) are connected one over the other to the bus electrode (361). The emitter electrodes (Es) of the elements (103 and 104) are connected one over the other to the bus electrode (362). The collector electrodes (Cs) of the elements (101 and 102) are connected one over the other to the bus electrode (363). The emitter electrodes (Es) of the elements (101 and 102) are connected one over the other to the bus electrode (364).

Claims

1. A power semiconductor device, comprising:

a first resin-sealed switching element including a first gate electrode, a first emitter electrode and a first collector electrode;

a second resin-sealed switching element including a second gate electrode, a second emitter electrode and a second collector electrode;

a third resin-sealed switching element including a third gate electrode, a third emitter electrode and a third collector electrode;

a fourth resin-sealed switching element including a fourth gate electrode, a fourth emitter electrode and a fourth collector electrode; and

a bus bar having first to fourth bus electrodes provided thereon in this order, wherein

said first resin-sealed switching element and said second resin-sealed switching element are arranged to face each other with said bus bar therebetween, and said third resin-sealed switching element and said fourth resin-sealed switching element are arranged to face each other with said bus bar therebetween,

said first collector electrode and said second collector electrode are connected one over the other with said first bus electrode,

said first emitter electrode and said second emitter electrode are connected one over the other with said second bus electrode,

said third collector electrode and said fourth collector electrode are connected one over the other with said third bus electrode, and

said third emitter electrode and said fourth emitter electrode are connected one over the other with said fourth bus electrode.

2. The power semiconductor device according to claim 1, wherein

said first to fourth resin-sealed switching elements are arranged on a surface of a single cooling fin, and

said first to fourth gate electrodes stand vertically with respect to said surface of said cooling fin.

3. The power semiconductor device according to claim 2, wherein

said first to fourth emitter electrodes and said first to fourth collector electrodes stand vertically with respect to said surface of said cooling fin.

4. The power semiconductor device according to claim 1, wherein

said second bus electrode is connected to a negative electrode,

said third bus electrode is connected to a positive electrode, and

said first bus electrode and said fourth bus electrode are connected to an intermediate electrode for inputting or outputting an intermediate potential between a potential of said negative electrode and a potential of said positive electrode.

5. The power semiconductor device according to claim 2, wherein

said second bus electrode is connected to a negative electrode,

said third bus electrode is connected to a positive electrode, and

said first bus electrode and said fourth bus electrode are connected to an intermediate electrode for inputting or outputting an intermediate potential between a potential of said negative electrode and a potential of said positive electrode.

6. The power semiconductor device according to claim 3, wherein

said second bus electrode is connected to a negative electrode,

said third bus electrode is connected to a positive electrode, and

said first bus electrode and said fourth bus electrode are connected to an intermediate electrode for inputting or outputting an intermediate potential between a potential of said negative electrode and a potential of said positive electrode.

7. A power semiconductor device, comprising:

a first resin-sealed switching element including a first gate electrode, a first emitter electrode and a first collector electrode;

a second resin-sealed switching element including a second gate electrode, a second emitter electrode and a second collector electrode;

a third resin-sealed switching element including a third gate electrode, a third emitter electrode and a third collector electrode;

a fourth resin-sealed switching element including a fourth gate electrode, a fourth emitter electrode and a fourth collector electrode;

a bus bar having first to fourth bus electrodes provided thereon in this order; and

a resin for sealing said first to fourth resin-sealed switching elements and said bus bar together, wherein

said first resin-sealed switching element and said second resin-sealed switching element are arranged to face each other with said bus bar therebetween, and said third resin-sealed switching element and said fourth resin-sealed switching element are arranged to face each other with said bus bar therebetween,

said first collector electrode and said second collector electrode are connected one over the other with said first bus electrode,

said first emitter electrode and said second emitter electrode are connected one over the other with said second bus electrode,

said third collector electrode and said fourth collector electrode are connected one over the other with said third bus electrode, and

said third emitter electrode and said fourth emitter electrode are connected one over the other with said fourth bus electrode.

8. The power semiconductor device according to claim 7, wherein

said first to fourth resin-sealed switching elements are arranged on a surface of a single cooling fin, and

said first to fourth gate electrodes stand vertically with respect to said surface of said cooling fin.

9. The power semiconductor device according to claim 8, wherein

said first to fourth emitter electrodes and said first to fourth collector electrodes stand vertically with respect to said surface of said cooling fin.

10. The power semiconductor device according to claim 7, wherein

said second bus electrode is connected to a negative electrode,

said third bus electrode is connected to a positive electrode, and

said first bus electrode and said fourth bus electrode are connected to an intermediate electrode for inputting or outputting an intermediate potential between a potential of said negative electrode and a potential of said positive electrode.

11. The power semiconductor device according to claim 8, wherein

said second bus electrode is connected to a negative electrode,

said third bus electrode is connected to a positive electrode, and

said first bus electrode and said fourth bus electrode are connected to an intermediate electrode for inputting or outputting an intermediate potential between a potential of said negative electrode and a potential of said positive electrode.

12. The power semiconductor device according to claim 9, wherein

said second bus electrode is connected to a negative electrode,

said third bus electrode is connected to a positive electrode, and

said first bus electrode and said fourth bus electrode are connected to an intermediate electrode for inputting or outputting an intermediate potential between a potential of said negative electrode and a potential of said positive electrode.