Insulative covering of probe tips

• US 6,870,381 B2
• Filed: 06/27/2003
• Issued: 03/22/2005
• Est. Priority Date: 06/27/2003
• Status: Active Grant

• Current Assignee: FormFactor Incorporated
• Original Assignee: FormFactor Incorporated
• Inventors: Grube, Gary W.
• Primary Examiner(s): GILMAN, ALEXANDER
• Application Number:
  US10/607,628
• Publication Number:
  US 20040266234A1
• Time in Patent Office: 634 Days
• Field of Search: 439/148, 439 65- 67, 324/754, 324/762, 324/765, 324/757, 438/14, 438/17, 438/107, 174/256, 257/48, 257/737, 298/40, 298/42, 295/93
• US Class Current: 324/754.03
• CPC Class Codes: G01R 1/07342 the body of the probe being at an angle other than perpendicular to test object, e.g. probe card
• CPC Class Codes: H01R 12/7076 for connection between PCB and component, e.g. display
• CPC Class Codes: H01R 13/2442 with a single cantilevered beam
• CPC Class Codes: H01R 13/2464 characterized by the contact point
• CPC Class Codes: H01R 13/447 Shutter or cover plate

Abstract

An insulative material is applied to one or more selected probe tips to disable those probes, and the probes are brought into contact with a semiconductor die. One or more tests are run on the die to verify sufficient testing of the die without the disabled probes. The process may be repeated with other probes disabled to determine which probes need not be used in testing the die.

Claims

1. A method of determining terminals of a semiconductor die to contact during test, said method comprising:

selecting a first subset of said terminals not to contact during testing of said die;

covering with an electrically insulative material tip(s) of a first subset of probes corresponding to said first subset of terminals, wherein said first subset of probes composes a plurality of probes corresponding to ones of said terminals;

bringing said plurality of probes into contact with said ones of said terminals of said die; and

verifying testing of said die.

2. The method of claim 1, wherein said first subset of terminals comprises one terminal.

3. The method of claim 1, wherein said first subset of terminals comprises at least two terminals.

4. The method of claim 1, wherein said plurality of probes are disposed on a probe card.

5. The method of claim 1, wherein said die composes an unsingulated semiconductor wafer.

6. The method of claim 1, wherein said insulative material comprises a material selected from one of an epoxy, a nylon, a starch, a vinyl, a styrene, a polyethylene, a polyproylene, a thermoplastic, or a rubber.

7. The method of claim 1, wherein said plurality of probes arm cantilevered beam probes.

8. The method of claim 1, wherein, if said testing of said die does not verify, said method further comprises:

selecting a second subset of said terminals not to contact during testing of said die;

removing said insulative material from said tip(s) of said first subset of probes;

covering with an insulative material tip(s) of a second subset of probes corresponding to said second subset of terminals;

bringing said plurality of probes into contact with said ones of said terminals of said die; and

verifying testing of said die.

9. The method of claim 8, wherein said step of removing said insulative material comprises removing said insulative material by dissolving, laser ablating, peeling, air blasting, water blasting, burning, or subliming said insulative material.