Multi-layered wiring board for slot coupling a transmission line to a waveguide

• US 6,870,438 B1
• Filed: 11/10/2000
• Issued: 03/22/2005
• Est. Priority Date: 11/10/1999
• Status: Active Grant

• Current Assignee: Kyocera Corporation
• Original Assignee: Kyocera Corporation
• Inventors: Shino, Naoyuki, Minamiue, Hidehiro, Koriyama, Shinichi, Kitazawa, Kenji
• Primary Examiner(s): LEE, BENNY T
• Application Number:
  US09/709,098
• Time in Patent Office: 1,593 Days
• Field of Search: 333/26, 333/33, 333/246, 333/247
• US Class Current: 333/26
• CPC Class Codes: H01L 2223/6633 Transition between different waveguide types
• CPC Class Codes: H01L 2224/45015 being circular
• CPC Class Codes: H01L 2224/45099 Material
• CPC Class Codes: H01L 2224/48091 Arched
• CPC Class Codes: H01L 2224/48227 connecting the wire to a bond pad of the item
• CPC Class Codes: H01L 23/66 High-frequency adaptations
• CPC Class Codes: H01L 24/48 of an individual wire connector
• CPC Class Codes: H01L 2924/00014 the subject-matter covered by the group, the symbol of which is combined with the symbol of this group, being disclosed without further technical details
• CPC Class Codes: H01L 2924/01021 Scandium [Sc]
• CPC Class Codes: H01L 2924/01079 Gold [Au]
• CPC Class Codes: H01L 2924/09701 Low temperature co-fired ceramic [LTCC]
• CPC Class Codes: H01L 2924/15153 the die mounting substrate comprising a recess for hosting the device
• CPC Class Codes: H01L 2924/1517 Multilayer substrate
• CPC Class Codes: H01L 2924/16152 Cap comprising a cavity for hosting the device, e.g. U-shaped cap
• CPC Class Codes: H01L 2924/16195 Flat cap [not enclosing an internal cavity]
• CPC Class Codes: H01L 2924/19039 impedance transition between different types of wave guides
• CPC Class Codes: H01L 2924/207 Diameter ranges
• CPC Class Codes: H01P 5/107 Hollow-waveguide/strip-line transitions
• CPC Class Codes: H05K 1/0237 High frequency adaptations H05K1/0216 takes precedence

Abstract

A wiring board includes a dielectric substrate, a signal transmission line formed on one surface of the dielectric substrate, a grounded layer formed on the other surface of the dielectric substrate, and a connection portion for connecting portion for connecting the signal transmission line to a waveguide, the connection portion being formed on the grounded layer. The grounded layer has a slot at a position opposed to an end of the signal transmission line. The connection portion includes a first dielectric portion disposed to cover the slot of the ground layer, a second dielectric portion laminated on the first dielectric portion, and a patch conductor provided at a position opposed to said slot on an interface between the first dielectric portion and the second dielectric portion. The wiring board enables the signals to be efficiently transmitted from the signal transmission line to the waveguide with a small loss and a small reflection.

Claims

1. A wiring board comprising:

a dielectric substrate;

a signal transmission line disposed on one surface of said dielectric substrate;

a grounded layer disposed on the other surface of said dielectric substrate; and

a connection portion for connecting the signal transmission line to a waveguide, said connection portion being disposed on the grounded layer;

wherein said grounded layer has a slot at a position opposed to an end of said signal transmission line; and

wherein said connection portion includes a first dielectric layer disposed so as to cover substantially the whole surface of the grounded layer disposed on the other surface of said dielectric substrate, a second dielectric layer is laminated on the first dielectric layer, and a patch conductor provided in an interface between said first dielectric layer and said second dielectric layer, a portion of said first dielectric layer positioned on said slot provides the first dielectric portion, and a portion of said second dielectric layer positioned over said slot provides the second dielectric portion.

2. A wiring board according to claim 1, wherein a connection member is provided on said second dielectric layer to secure the electrically conducting walls of the waveguide, said connection member has an opening of a size substantially the same as the shape of an opening portion in cross section of the waveguide that is to be connected, and the inner surfaces of the opening of said connection member comprises an electric conductor.

3. A wiring board according to claim 1, wherein vertical conductors are provided penetrating through the first dielectric layer and the second dielectric layer so as to surround said patch conductor with said patch conductor at a center of said vertical conductors, said first dielectric portion and said second dielectric portion are disposed in a region surrounded by said vertical conductors, and the conductor wall of the waveguide to be connected to the connection portion is electrically connected to said grounded layer via said vertical conductors.

4. A wiring board according to claim 3, wherein the first dielectric portion and the second dielectric portion surrounded by said vertical conductors have an outer shape which is the same as, or smaller than, the shape of an opening in cross section of the waveguide that is to be connected.

5. A wiring board according claim 4, wherein a connection member is provided on said second dielectric layer to secure the electrically conducting walls of the waveguide, said connection member has an opening of a size larger than the respective outer shapes of said first and second dielectric portions but is substantially the same as the shape of the opening portion in cross section of the waveguide that is to be connected, and the inner surfaces of the opening of said connection member comprises an electric conductor.

6. A wiring board according to claim 1, wherein a maximum length SL of said slot in a direction at right angles with the signal transmission line is from 1 to 2 times as great as the wave length of signals propagating through the dielectric substrate.

7. A wiring board according to claim 6, wherein said patch conductor has a rectangular shape and, when a maximum length W1 of said patch conductor in a direction at right angles with said signal transmission line, and a maximum length L1 thereof in a direction in parallel with said signal transmission line, there holds a relationship L1>

WI.

8. A wiring board according to claim 7, wherein, when the wave length of signals propagating through the dielectric substrate is denoted by λ

, the length L1 satisfies the condition of the following formula,

10λ

/64<

L1<

31λ

/64

or

33λ

/64<

L1<

63λ

/64.