Exposure method and apparatus, and device manufacturing method
First Claim
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1. An exposure method of transferring a master pattern onto a substrate while moving a controlled element concerning exposure operation, comprising:
- transferring the master pattern onto the substrate while moving the controlled element in accordance with a target locus generated in correspondence with a shape characteristic of the mask pattern and a shape characteristic of a pattern already formed on the substrate.
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Abstract
A scanning exposure apparatus is provided that is capable of increasing the overlay accuracy. Every time a reticle is exchanged, a direction overlay correction table is updated. A control device for the exposure apparatus corrects the target positions (target locus) of a wafer stage on the basis of the direction overlay correction table.
25 Citations
19 Claims
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1. An exposure method of transferring a master pattern onto a substrate while moving a controlled element concerning exposure operation, comprising:
transferring the master pattern onto the substrate while moving the controlled element in accordance with a target locus generated in correspondence with a shape characteristic of the mask pattern and a shape characteristic of a pattern already formed on the substrate.
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2. A device manufacturing method comprising:
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the first coating step of coating a substrate with a first resist;
the first exposure step of transferring a first master pattern onto the substrate coated with the first resist;
the first developing step of developing the substrate bearing the first master pattern;
the second coating step of coating the developed substrate with a second resist;
the second exposure step of transferring a second master pattern onto the substrate coated with the second resist; and
the second developing step of developing the substrate bearing the second master pattern, wherein the second exposure step includes the correction step of correcting a target locus of a controlled element concerning exposure operation on the basis of correction information corresponding to a shape characteristic of the second master pattern and/or a shape characteristic of a pattern formed on the substrate after the first developing step, and the transfer step of transferring the second master pattern onto the substrate while moving the controlled element toward the corrected target locus. - View Dependent Claims (3)
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4. An exposure method of transferring a pattern onto a substrate while moving an element concerning the transfer, said method comprising a step of:
transferring a second pattern onto the substrate, onto which a first pattern has been transferred, while moving the element based on information prepared with respect to each position of the element for correcting an overlay error between the first and second patterns. - View Dependent Claims (5, 6, 7, 8, 9)
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10. An exposure apparatus for transferring a pattern onto a substrate while moving an element concerning the transfer, said apparatus comprising:
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a moving unit which moves the element; and
a control unit which controls said moving unit so as to move the element based on information prepared with respect to each position of the element for correcting an overlay error between first and second patterns during transferring the second pattern onto the substrate onto which the first pattern has been transferred. - View Dependent Claims (11, 12, 13, 14, 15, 16, 17)
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18. An exposure method of scan-exposing a surface of a substrate placed on a substrate stage to a pattern of an original placed on an original stage through a projection optical system, said method comprising steps of:
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setting a target locus, of the substrate stage, corresponding to the original;
preparing a correction table for correcting a shape error of a pattern of the original formed on the substrate; and
correcting the target locus of the substrate stage based on the correction table.
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19. An exposure method of scan-exposing a surface of a substrate placed on a substrate stage to a pattern of an original placed on an original stage through a projection optical system, said method comprising:
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setting a target locus, of the original stage, corresponding to the original;
preparing a correction table for correcting a shape error of a pattern of the original formed on the substrate; and
correcting the target locus of the original stage based on the correction table.
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Specification