Powerpack laser diode assemblies
First Claim
1. A laser diode assembly for high output power applications, comprising:
- a carrier having a top and bottom, the top having a thermally conductive layer formed thereon, the thermally conductive layer sized for attaching at least two bonding members thereto;
a laser diode having a top and bottom, the bottom of the laser diode being electrically coupled to the carrier, the top of the laser diode having first and second thermally conductive pads formed on opposing sides of the top, the first and second thermally conductive pads each sized for attaching at least one bonding member thereto;
a first bonding member thermally coupling the first thermally conductive pad to the thermally conductive layer, and a second bonding member thermally coupling the second thermally conductive pad to the thermally conductive layer, wherein at least one of the first and second bonding members carries an electrical signal.
1 Assignment
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Accused Products
Abstract
In one aspect, the invention provides a laser diode assembly, comprising a carrier, a laser diode, a first bonding member, and a second bonding member. The carrier has a conductive layer formed thereon that is sized for attaching at least two bonding members thereto. The laser diode is operably coupled to the carrier and has first and second conductive pads formed thereon. The first and second conductive pads are each sized for attaching at least one bonding member thereto. The first bonding member couples the first conductive pad to the conductive layer of the carrier, and the second bonding member couples the second conductive pad to the conductive layer of the carrier.
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Citations
30 Claims
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1. A laser diode assembly for high output power applications, comprising:
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a carrier having a top and bottom, the top having a thermally conductive layer formed thereon, the thermally conductive layer sized for attaching at least two bonding members thereto;
a laser diode having a top and bottom, the bottom of the laser diode being electrically coupled to the carrier, the top of the laser diode having first and second thermally conductive pads formed on opposing sides of the top, the first and second thermally conductive pads each sized for attaching at least one bonding member thereto;
a first bonding member thermally coupling the first thermally conductive pad to the thermally conductive layer, and a second bonding member thermally coupling the second thermally conductive pad to the thermally conductive layer, wherein at least one of the first and second bonding members carries an electrical signal. - View Dependent Claims (2, 3, 4, 5, 6, 7, 8, 9, 10, 11, 12, 13, 14, 15, 17, 18, 19, 20, 21, 22, 23, 24, 25, 26)
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16. The laser diode assembly of 15 further comprising a thermo electric cooling (TEC) device operably coupled to the heat sink.
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27. A laser diode assembly, comprising:
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a carrier structured and arranged for mounting a laser diode chip thereto, the carrier comprising a first electrode area, a second electrode area, and a thermally conductive area;
a laser diode having a first side attached to the second electrode area of the carrier and having a second side comprising first and second thermally conductive pads;
a first bonding member coupling the first thermally conductive pad of the laser diode to the first electrode area of the carrier; and
a second bonding member coupling the second thermally conductive pad of the laser diode to the thermally conductive area of the carrier.
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28. A laser diode assembly, comprising:
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a carrier having a thermally conductive layer formed thereon;
a laser diode electrically coupled to the carrier; and
a means for transferring heat generated at the diode to the thermally conductive layer on the carrier, the means for transferring heat being thermally coupled to the carrier from the laser diodes, wherein the means for transferring heat comprises first and second thermally conductive pads disposed on a side of the laser diode and first and second bonding members coupling the first and second thermally conductive pads of the laser diode to the conductive layer on the carrier. - View Dependent Claims (29, 30)
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Specification