Real time dispatcher application program interface

• US 6,871,113 B1
• Filed: 11/26/2002
• Issued: 03/22/2005
• Est. Priority Date: 11/26/2002
• Status: Active Grant

• Current Assignee: Advanced Micro Devices, Inc.
• Original Assignee: Advanced Micro Devices, Inc.
• Inventors: Maxim, Carmen Adriana, Likes, Donald Craig, Rives, Noel Curtis, Yazback, Marwane Jawad
• Primary Examiner(s): KASENGE, CHARLES R
• Application Number:
  US10/304,413
• Time in Patent Office: 847 Days
• Field of Search: 700/83, 700/108, 700/109, 700/110, 700/115, 700/121, 700/180, 717/105
• US Class Current: 700/121
• CPC Class Codes: G05B 19/41865 characterised by job scheduling, process planning, material flow
• CPC Class Codes: G05B 2219/31265 Control process by combining history and real time data
• CPC Class Codes: G05B 2219/31324 Distributed real time knowledge, database
• CPC Class Codes: G05B 2219/45031 Manufacturing semiconductor wafers
• CPC Class Codes: Y02P 90/02 Total factory control, e.g. smart factories, flexible manufacturing systems [FMS] or integrated manufacturing systems [IMS]

Abstract

An interface for a semiconductor fabrication facility which includes a real time dispatch system that provides near real time information regarding processing of semiconductor wafers and a middleware component. The interface includes a real time dispatcher application program interface coupled between the fabrication facility and the middleware component. The real time dispatcher application program interface provides a common interface which provides information to the middleware component.

Claims

1. An interface for a semiconductor fabrication facility including a real time dispatch system providing near real time information regarding processing of semiconductor wafers and a middleware component, the interface comprising:

a real time dispatcher application program interface coupled between the fabrication facility and the middleware component, the real time dispatcher application program interface providing a common interface for providing information to the middleware component.

2. The interface of claim 1 wherein:

the real time dispatcher application program interface publishes lot data to the middleware component.

3. The interface of claim 1 wherein:

the real time dispatcher application program interface publishes lot history data to the middleware component.

4. The interface of claim 1 wherein:

the real time dispatcher application program interface publishes lot attribute data to the middleware component.

5. The interface of claim 1 wherein:

the real time dispatcher application program interface is a client of the real time dispatcher.

6. The interface of claim 1 wherein:

the fabrication facility includes a manufacturing execution system; and

,

the real time dispatcher application program interface is publishes manufacturing execution system data to the middleware component.

7. The interface of claim 1 wherein:

the fabrication facility fabricates semiconductor devices.

8. A method for interfacing between a fabrication facility and a middleware component comprising:

providing a real time dispatcher application program interface coupled between the fabrication facility and the middleware component, the real time dispatcher application program interface providing a common interface for providing information to the middleware component from the fabrication facility; and

publishing information from the fabrication facility to the middleware component via the real time dispatcher application program interface.

9. The method of claim 8 wherein:

the publishing information includes publishing lot data to the middleware component.

10. The method of claim 8 wherein:

the publishing information includes publishing lot history data to the middleware component.

11. The method of claim 8 wherein:

the publishing information includes publishing lot attribute data to the middleware component.

12. The method of claim 8 wherein:

the fabrication facility includes a real time dispatcher; and

,

the real time dispatcher application program interface is a client of the real time dispatcher.

13. The method of claim 8 wherein:

the fabrication facility includes a manufacturing execution system; and

,

the real time dispatcher application program interface publishes manufacturing execution system data to the middleware component.

14. The method of claim 8 wherein:

the fabrication facility fabricates semiconductor devices.

15. An computer readable media encoded with an application for providing an interface for a semiconductor fabrication facility including a real time dispatch system providing near real time information regarding processing of semiconductor wafers and a middleware component, the application comprising:

a real time dispatcher application program interface module coupled between the fabrication facility and the middleware component, the real time dispatcher application program interface providing a common interface for providing information to the middleware component.

16. The application of claim 15 wherein:

the real time dispatcher application program interface module includes instructions for publishing lot data to the middleware component.

17. The application of claim 15 wherein:

the real time dispatcher application program interface module includes instructions for publishing lot history data to the middleware component.

18. The application of claim 15 wherein:

the real time dispatcher application program interface module includes instructions for publishing information includes publishing lot attribute data to the middleware component.

19. The application of claim 15 wherein:

the fabrication facility includes a real time dispatcher; and

,

the real time dispatcher application program interface module is a client of the real time dispatcher.

20. The application of claim 15 wherein:

the fabrication facility includes a manufacturing execution system; and

,

the real time dispatcher application program interface module publishes manufacturing execution system data to the middleware component.

21. The application of claim 15 wherein:

the fabrication facility conductor devices.