Transfer material for wiring substrate
First Claim
Patent Images
1. A transfer material comprising:
- a first metal layer as a carrier, a second metal layer as a wiring pattern wherein said second metal layer is substantially flat, a peel layer that is sandwiched between the first metal layer and the second metal layer and allows the first metal layer and the second metal layer to be adhered releasably, wherein a convex portion corresponding to the wiring pattern is formed on the surface portion of the first metal layer, and the peel layer and the second metal layer are formed on a region of the convex portion.
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Abstract
A transfer material capable of transferring a fine wiring pattern to a substrate reliably and easily. The transfer material includes at least three layers of a first metal layer as a carrier, a second metal layer that is transferred to the substrate as a wiring pattern, and a peel layer adhering the first and second metal layers releasably. On the surface portion of the first metal layer, a concave and convex portion corresponding to the wiring pattern is formed, and the peel layer and the second metal layer are formed on a region of the convex portions.
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Citations
22 Claims
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1. A transfer material comprising:
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a first metal layer as a carrier, a second metal layer as a wiring pattern wherein said second metal layer is substantially flat, a peel layer that is sandwiched between the first metal layer and the second metal layer and allows the first metal layer and the second metal layer to be adhered releasably, wherein a convex portion corresponding to the wiring pattern is formed on the surface portion of the first metal layer, and the peel layer and the second metal layer are formed on a region of the convex portion. - View Dependent Claims (2, 3, 4, 5, 6, 7, 8, 9, 10, 11, 12, 13, 14, 15, 16, 17, 18, 19, 20, 21, 22)
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Specification