Sensor design and process
First Claim
1. An apparatus for detecting an environmental condition, comprising:
- a housing;
a measurement mass wafer coupled to the housing, the measurement mass wafer being responsive to the environmental condition;
at least one cap wafer coupled to the housing;
a plurality of bumpers geometrically disposed on the cap wafer for providing the sensor overshock protection; and
at least one electrode coupled to the measurement mass wafer, wherein the at least one electrode is adapted to reduce stiction during operation.
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Accused Products
Abstract
An accelerometer (305) for measuring seismic data. The accelerometer (305) includes an integrated vent hole for use during a vacuum sealing process and a balanced metal pattern for reducing cap wafer bowing. The accelerometer (305) also includes a top cap press frame recess (405) and a bottom cap press frame recess (420) for isolating bonding pressures to specified regions of the accelerometer (305). The accelerometer (305) is vacuum-sealed and includes a balanced metal pattern (730) to prevent degradation of the performance of the accelerometer (305). A dicing process is performed on the accelerometer (305) to isolate the electrical leads of the accelerometer (305). The accelerometer (305) further includes overshock protection bumpers (720) and patterned metal electrodes to reduce stiction during the operation of the accelerometer (305).
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Citations
21 Claims
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1. An apparatus for detecting an environmental condition, comprising:
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a housing;
a measurement mass wafer coupled to the housing, the measurement mass wafer being responsive to the environmental condition;
at least one cap wafer coupled to the housing;
a plurality of bumpers geometrically disposed on the cap wafer for providing the sensor overshock protection; and
at least one electrode coupled to the measurement mass wafer, wherein the at least one electrode is adapted to reduce stiction during operation. - View Dependent Claims (2, 3, 4, 5, 6, 7, 8, 9, 10, 11, 12)
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13. A method for protecting a sensor during operation, the sensor comprising a housing, a measurement mass wafer coupled to the housing for detecting an environmental condition, at least one cap wafer coupled to the housing and at least one electrode coupled to the measurement mass wafer, the method comprising;
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providing overshock protection to the sensor using a plurality of bumpers geometrically disposed on the cap wafer; and
adapting the at least one electrode to reduce stiction during sensor operation. - View Dependent Claims (14, 15, 16, 17, 18, 19)
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20. An apparatus for detecting an environmental condition, comprising:
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a housing;
a measurement mass wafer coupled to the housing, the measurement mass wafer being responsive to the environmental condition;
at least one cap wafer coupled to the housing;
one or more bumpers disposed on the cap wafer for providing the sensor overshock protection; and
one or more electrodes coupled to the measurement mass wafer, wherein the one or more bumpers and the one or more electrodes are each patterned to reduce stiction during operation.
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21. An apparatus for detecting an environmental condition, comprising:
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a housing;
a measurement mass wafer coupled to the housing, the measurement mass wafer being responsive to the environmental condition;
at least one cap wafer coupled to the housing;
one or more bumpers disposed on the cap wafer for providing the sensor overshock protection; and
one or more electrodes coupled to the measurement mass wafer, wherein the one or more bumpers are patterned as circles or ridges to reduce stiction during operation.
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Specification