Pressure sensor module with sensor cell and adapter

• US 6,871,546 B2
• Filed: 02/14/2002
• Issued: 03/29/2005
• Est. Priority Date: 02/20/2001
• Status: Active Grant

• Current Assignee: Robert Bosch GmbH
• Original Assignee: Robert Bosch GmbH
• Inventors: Scheurich, Heiko, Habibi, Masoud, Mast, Martin, Rogge, Berthold
• Primary Examiner(s): Lefkowitz, Edward
• Assistant Examiner(s): Allen, Andre
• Application Number:
  US10/257,894
• Publication Number:
  US 20030151126A1
• Time in Patent Office: 1,139 Days
• Field of Search: 737/56, 737/25, 737/15
• US Class Current: 73/754
• CPC Class Codes: G01L 19/003 using a detachable interface or adapter between the process medium and the pressure gauge
• CPC Class Codes: G01L 19/0084 to the outside of the housing other details about the housing see G01L19/14
• CPC Class Codes: G01L 19/0645 using isolation membranes, specially adapted for protection
• CPC Class Codes: G01L 19/0672 Leakage or rupture protection or detection
• CPC Class Codes: G01L 19/143 Two part housings
• CPC Class Codes: G01L 19/147 Details about the mounting of the sensor to support or covering means
• CPC Class Codes: H01L 2224/48091 Arched
• CPC Class Codes: H01L 2924/00014 the subject-matter covered by the group, the symbol of which is combined with the symbol of this group, being disclosed without further technical details

Abstract

In a pressure sensor module according to the prior art, which is intended for detecting the pressure of a corrosive medium, the conventional sensor cell with a pressure sensor chip is modified in order to protect it from corrosion, which results in a large volume for a pressure-transmitting-fluid. This is disadvantageous for the calibration and for a high degree of measurement precision.

In a pressure sensor module (1) according to the invention, a convention sensor cell (5) is used that has an adapter (21) connected to it, which has a very small volume for a pressure-transmitting medium.

Claims

1. A pressure senior module, comprised at least of a pressure sensor chip for detecting a pressure, wherein said pressure sensor chip is connected to a pressure fitting that conducts the pressure to the pressure sensor chip, wherein the pressure fitting (19) has an adapter (21) connected to it, wherein said adapter receives the pressure and transmits the pressure to the pressure sensor chip (7) by means of the pressure fitting (19), wherein said adapter protects the pressure sensor chip (7) from mediums that could damage the pressure sensor chip (7), wherein the pressure sensor module (1) is disposed in an Insertion opening (69) of a wall (53), wherein the pressure sensor module (1) has a separating membrane (29), wherein the wall (53) encloses a medium(59), wherein said medium is in contact with the separating membrane (9), and wherein the pressure sensor module (1) can be moved partway out from the insertion opening (69) when the medium (59) freezes and expands.

2. The pressure sensor module according to claim 1, wherein the adapter (21) has a hole (23) passing through it, wherein said hole is connected at a sensor end (25) to the pressure fitting (19) and at a medium end (27), the hole is closed by means of a separating membrane (29).

3. The pressure sensor module according to claim 2, wherein the pressure fitting (19), the hole (23), and a filling hole (32) of the adapter (21) are filled with a fluid.

4. The pressure sensor module according to claim 1, wherein the pressure sensor chip (7) has a top side (47) to which bonding wires (13) are electrically connected, and wherein an underside (49) of the pressure sensor chip (7) is connected to the pressure fitting (19).

5. The pressure sensor module according to claim 2, wherein the adapter (21) has a filling hole (32), wherein the filling hole is connected to the hole (23) and is used for the introduction of a fluid.

6. The pressure sensor module according to claim 1, wherein the pressure sensor chip (7) is disposed in a sensor cell (5), wherein the sensor cell has external electrical sensor connection elements (15) and wherein a printed circuit board (36) is electrically connected to the sensor connection elements (15).

7. The pressure sensor module according to claim 6, wherein the printed circuit board (36) is electrically connected to electrical plug connections (39), wherein the pressure sensor module (1) has a pressure sensor module housing (45), and wherein the electrical plug connections (39), together with the pressure sensor module housing (45), comprise a plug connector (43).

8. The pressure sensor module according to claim 1, wherein the pressure sensor chip (7) is connected to electrical plug connections (39), wherein the pressure sensor module (1) has a pressure sensor module housing (45), and wherein the electrical plug connections (39), together with the pressure sensor module housing (45), comprise a plug connector (43).

9. The pressure sensor module according to claim 1, wherein the pressure sensor chip (7) is disposed in a preassembled sensor cell (5), wherein said preassembled sensor cell has external electrical sensor connection elements (15).

10. The pressure sensor module according claim 1, wherein the pressure sensor chip (7) has a membrane (17), wherein said membrane generates a pressure-dependent measurement signal.

11. The pressure sensor module according to claim 7, wherein the pressure sensor module (1) has an adapter (21) and wherein the pressure sensor module housing (45) is connected to the adapter (21).

12. The pressure sensor module according to claim 1, wherein the pressure sensor module (1) is disposed on a fastening flange (51), wherein said fastening flange is embodied as flexible so that at least part of the fastening flange (51) can be moved in relation to the wail (53) and the pressure sensor module (1) can be moved partway out from the insertion opening (69).

13. The pressure sensor module according to claim 1, wherein the pressure sensor module (1) is disposed on a fastening flange (51), wherein said fastening flange engages a spring (55) so that the fastening flange (51) can be moved in relation to the wall (53) when a particular force acts on the spring (55) so that the pressure sensor module (1) can be moved partway out from the insertion opening (69).