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High-density illumination system

  • US 6,871,982 B2
  • Filed: 01/22/2004
  • Issued: 03/29/2005
  • Est. Priority Date: 01/24/2003
  • Status: Active Grant
First Claim
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1. An illuminating system, comprising:

  • an electrical interconnection plate with an array of electrically conductive circuitry arranged for interconnecting one or more LED chips to positive and negative voltage sources;

    an array of LED chips, said LED chips equally sized and spaced from each other a distance S that is less than or equal to width W of said LED chip;

    an array of metallically reflecting bins whose center to center spacing is equal to W+S, each said bin comprising a clear output aperture and a clear input aperture formed by one or more tapered metallically reflecting sidewalls extending between them;

    a first light redirecting means disposed beyond said array of metallically reflecting bins that transmits light in a first angular range and reflects light in a second angular range back towards said array of bins;

    a second light redirecting means disposed beyond said first light redirecting means that transmits light in a first angular range and reflects light in a second angular range back towards said first light redirecting means; and

    said array of LED chips bonded electrically to said array of electrically conductive circuitry on said electrical interconnection plate, said array of metallically reflecting bins disposed just above said electrical interconnection plate such that every said LED chip in said array of LED chips extends in and through the center of every said input aperture.

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