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Device transferring method, and device arraying method and image display unit fabricating method using the same

  • US 6,872,635 B2
  • Filed: 04/09/2002
  • Issued: 03/29/2005
  • Est. Priority Date: 04/11/2001
  • Status: Expired due to Term
First Claim
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1. A device transferring method of selectively transferring devices arrayed on a first substrate to a second substrate on which an adhesive resin layer is previously formed, the method comprising the steps of:

  • selectively heating te adhesive resin layer on the second substrate by laser irradiation from a back surface side of the second substrate; and

    curing a selectively heated portion of the adhesive resin layer, thereby adhesively bonding devices to be transferred of the devices arrayed on the first substrate to the second substrate.

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