Encapsulated energy-dissipative fuse for integrated circuits and method of making the same
First Claim
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1. A laser-programmable fuse structure for an integrated circuit device, comprising:
- a conductive layer, said conductive layer completing a conductive path between wiring segments included in a wiring layer; and
an organic material encapsulated underneath said conductive layer and in continuous contact with said conductive layer;
wherein the fuse structure is blown open by application of a beam of laser energy thereto.
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Abstract
A laser-programmable fuse structure for an integrated circuit device is disclosed. In an exemplary embodiment of the invention, the fuse structure includes a conductive layer, the conductive layer completing a conductive path between wiring segments in a wiring layer. An organic material is encapsulated underneath the conductive layer, wherein the fuse structure is blown open by application of a beam of laser energy thereto.
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Citations
9 Claims
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1. A laser-programmable fuse structure for an integrated circuit device, comprising:
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a conductive layer, said conductive layer completing a conductive path between wiring segments included in a wiring layer; and
an organic material encapsulated underneath said conductive layer and in continuous contact with said conductive layer;
wherein the fuse structure is blown open by application of a beam of laser energy thereto. - View Dependent Claims (2, 3, 4, 5, 6, 7, 8, 9)
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Specification