Encapsulated energy-dissipative fuse for integrated circuits and method of making the same

• US 6,873,027 B2
• Filed: 10/26/2001
• Issued: 03/29/2005
• Est. Priority Date: 10/26/2001
• Status: Expired due to Fees

• Current Assignee: International Business Machines Corporation
• Original Assignee: International Business Machines Corporation
• Inventors: Dalton, Timothy J., Petrarca, Kevin S., Volant, Richard P.
• Primary Examiner(s): Zarabian, Amir
• Assistant Examiner(s): Lewis, Monica
• Application Number:
  US10/002,447
• Publication Number:
  US 20030080393A1
• Time in Patent Office: 1,250 Days
• Field of Search: 257/173, 257/529, 257/665, 257/910, 257/919
• US Class Current: 257/529
• CPC Class Codes: H01L 23/5258 the change of state resulting from the use of an external beam, e.g. laser beam or ion beam
• CPC Class Codes: H01L 2924/00 Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
• CPC Class Codes: H01L 2924/0002 Not covered by any one of groups H01L24/00, H01L24/00 and H01L2224/00

Abstract

A laser-programmable fuse structure for an integrated circuit device is disclosed. In an exemplary embodiment of the invention, the fuse structure includes a conductive layer, the conductive layer completing a conductive path between wiring segments in a wiring layer. An organic material is encapsulated underneath the conductive layer, wherein the fuse structure is blown open by application of a beam of laser energy thereto.

Claims

1. A laser-programmable fuse structure for an integrated circuit device, comprising:

a conductive layer, said conductive layer completing a conductive path between wiring segments included in a wiring layer; and

an organic material encapsulated underneath said conductive layer and in continuous contact with said conductive layer;

wherein the fuse structure is blown open by application of a beam of laser energy thereto.

2. The fuse structure of claim 1, further comprising:

a liner material in electrical contact with said wiring segments and said conductive layer, said liner material further encapsulating said organic material between said wiring layer and said conductive layer.

3. The fuse structure of claim 1, wherein said organic material is selected from a group that includes a polyimide, a polyamide, a polyarlyene ether, a polyaromatic hydrocarbon (PAH), and a conductive polyaniline.

4. The fuse structure of claim 2, wherein said liner material is selected from a group that includes TaN, Ta, TiN, Ti, W, WN, TaSiN, TiSiN, or alloys therefrom.

5. The fuse structure of claim 1 wherein said conductive layer is selected from a group that includes TaN, Ta, TiN, Ti, W, WN, TaSiN, TiSiN, or alloys therefrom.

6. The fuse structure of claim 2, further comprising:

a pair of vias formed within an insulating layer and extending down to said wiring segments; and

a mesa region of said insulating layer formed between said pair of vias;

wherein said liner material is formed upon sides of said mesa region and said wiring segments.

7. The fuse structure of claim 6, wherein said pair of vias is filled with said organic material.

8. The fuse structure of claim 7, wherein said organic material further occupies an inner area of the fuse structure, said inner area between the top of said mesa region and said conductive layer.

9. The fuse structure of claim 8, wherein said conductive layer covers said inner area and said organic material, thereby completing said conductive path.