Microwave monolithic integrated circuit package
First Claim
Patent Images
1. A microwave monolithic integrated circuit (MMIC) package comprising:
- a single MMIC including a plurality of pads forming chip input and output pads and DC pads;
a base plate that is matched as to its coefficient of thermal expansion (CTE) with the MMIC;
a solder preform contained on the base plate, said MMIC being mounted on the solder preform; and
a chip cover having openings and covering the MMIC to form a MMIC package that can be automatically picked and placed, wherein the base plate and chip cover are configured with respective portions that engage each other and such that the chip input and output and DC pads on said MMIC are directly exposed to atmosphere through openings of the chip cover for wire and ribbon bonding, wherein the base plate and MMIC are secured together by a solder flow process from said solder preform.
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Abstract
A microwave monolithic integrated circuit (MMIC) package includes a MMIC and a base plate that is matched as to its coefficient of thermal expansion (CTE) with the MMIC. A solder preform is contained on the base plate. The MMIC is mounted on the solder preform. A chip cover covers the MMIC and are configured with respective portions that engage each other such that any pads on the MMIC are exposed for wire and ribbon bonding. The base plate and MMIC are secured together by a solder flow process from the solder preform.
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Citations
15 Claims
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1. A microwave monolithic integrated circuit (MMIC) package comprising:
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a single MMIC including a plurality of pads forming chip input and output pads and DC pads;
a base plate that is matched as to its coefficient of thermal expansion (CTE) with the MMIC;
a solder preform contained on the base plate, said MMIC being mounted on the solder preform; and
a chip cover having openings and covering the MMIC to form a MMIC package that can be automatically picked and placed, wherein the base plate and chip cover are configured with respective portions that engage each other and such that the chip input and output and DC pads on said MMIC are directly exposed to atmosphere through openings of the chip cover for wire and ribbon bonding, wherein the base plate and MMIC are secured together by a solder flow process from said solder preform. - View Dependent Claims (2, 3, 4, 5, 6, 7, 8, 9)
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10. A microwave monolithic integrated circuit (MMIC) package comprising:
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a single MMIC including a plurality of pads forming chip input and output pads and DC pads;
a substantially rectangular configured base plate that is matched as to its coefficient of thermal expansion (CTE) with the MMIC, said base plate including opposing side rails that extend along a portion of formed edges;
a solder preform contained on the base plate, said MMIC being mounted on the solder perform; and
a chip cover having openings and covering the MMIC to form a package that can be automatically picked and placed, and secured on said side rails of said base plate, and having overlap legs extending down to said base plate, wherein the base plate, side rails, chip cover and overlap legs are configured such that the chip input and output and DC pads on said MMIC are directly exposed to atmosphere through openings of the chip cover for wire and ribbon bonding. - View Dependent Claims (11, 12, 13, 14, 15)
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Specification