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Method for detecting the reliability of integrated semiconductor components at high temperatures

  • US 6,873,170 B2
  • Filed: 01/02/2004
  • Issued: 03/29/2005
  • Est. Priority Date: 07/23/2001
  • Status: Expired due to Fees
First Claim
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1. A method for detecting a reliability of an integrated semiconductor component, which comprises:

  • using a temperature sensor including at least a portion of a parasitic functional element of the semiconductor component to perform a measurement mode for measuring a temperature that is caused by a heating element and that is actually present at the semiconductor component;

    performing a stress mode for stressing the semiconductor component at least in a manner dependent on a temperature of the heating element; and

    evaluating a failure instant of the semiconductor component at least in a manner dependent on the temperature that is caused by the heating element.

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