Paired multi-layered dielectric independent passive component architecture resulting in differential and common mode filtering with surge protection in one integrated package

• US 6,873,513 B2
• Filed: 09/16/2003
• Issued: 03/29/2005
• Est. Priority Date: 04/08/1997
• Status: Expired due to Fees

• Current Assignee: X2Y Attenuators, LLC
• Original Assignee: X2Y Attenuators, LLC
• Inventors: Anthony, Anthony A.
• Primary Examiner(s): Jackson, Stephen W.
• Application Number:
  US10/443,764
• Publication Number:
  US 20040027771A1
• Time in Patent Office: 560 Days
• Field of Search: 361/78, 361/56, 361/58, 361/91.1, 361/91.2, 361/91.3, 361/115, 361/113, 361/118, 361/117, 361/120, 361/127
• US Class Current: 361/118
• CPC Class Codes: H01C 7/18 comprising a plurality of layers stacked between terminals
• CPC Class Codes: H01G 4/012 Form of non-self-supporting electrodes
• CPC Class Codes: H01G 4/35 Feed-through capacitors or anti-noise capacitors
• CPC Class Codes: H01L 23/50 for integrated circuit devices, e.g. power bus, number of leadsH01L23/482 - H01L23/498 take precedence
• CPC Class Codes: H01L 23/552 Protection against radiation, e.g. light or electromagnetic waves
• CPC Class Codes: H01L 2924/00 Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
• CPC Class Codes: H01L 2924/0002 Not covered by any one of groups H01L24/00, H01L24/00 and H01L2224/00
• CPC Class Codes: H01L 2924/3011 Impedance
• CPC Class Codes: H01L 2924/3025 Electromagnetic shielding
• CPC Class Codes: H03H 1/0007 of radio frequency interference filters
• CPC Class Codes: H03H 2001/0014 Capacitor filters, i.e. capacitors whose parasitic inductance is of relevance to consider it as filter
• CPC Class Codes: H05K 1/141 One or more single auxiliary printed circuits mounted on a main printed circuit, e.g. modules, adapters H05K1/142 and H05K1/147 take precedence
• CPC Class Codes: H05K 1/162 incorporating printed capacitors
• CPC Class Codes: H05K 3/3436 having an array of bottom contacts, e.g. pad grid array or ball grid array components

Abstract

The present invention relates to a passive electronic component architecture employed in conjunction with various dielectric and combinations of dielectric materials to provide one or more differential and common mode filters for the suppression of electromagnetic emissions and surge protection. The architecture allows single or multiple components to be assembled within a single package such as an integrated circuit or connector. The component'"'"'s architecture is dielectric independent and provides for integration of various electrical characteristics within a single component to perform the functions of filtering, decoupling, fusing and surge suppression, alone or in combination.

Claims

1. An apparatus comprising:

a first ground conductive plate;

a second ground conductive plate;

a third ground conductive plate;

a first electrode conductive plate;

and a second electrode conductive plate;

wherein said first electrode conductive plate is disposed between said first ground conductive plate and said second ground conductive plate;

wherein said second electrode conductive plate is disposed between said second ground conductive plate and said third ground conductive plate;

wherein said first ground conductive plate, said second ground conductive plate, and said third ground conductive plate are conductively interconnected; and

wherein said first electrode conductive plate is shielded from said second electrode conductive plate by the ground conductive plates.

2. The apparatus of claim 1, further comprising:

an electrically non-conductive material;

wherein said electrically non-conductive material is disposed between at least one of said first ground conductive plate and said second ground conductive plate and said second ground conductive plate and said third ground conductive plate.

3. The apparatus of claim 1, wherein said first ground conductive plate, said second ground conductive plate, and said third ground conductive plate are disposed symmetrically relative to said first electrode conductive plate and said second electrode conductive plate.

4. The apparatus of claim 1, wherein said first electrode conductive plate and said second electrode conductive plate are disposed symmetrically relative to the first, second, and third ground conductive plates.

5. The apparatus of claim 1, wherein said first ground conductive plate, said second ground conductive plate, and said third ground conductive plate are of similar size and shape as one another.

6. The apparatus of claim 1, wherein said first electrode conductive plate and said second electrode conductive plate are of similar size and shape to one another.

7. The apparatus of claim 1 designed for mounting on a motor housing.

8. The apparatus of claim 1 having a surface aperture region designed to oppose a motor shaft.

9. The apparatus of claim 8 wherein said surface aperture region exists between apertures in the first, second, and third ground conductive plates and the first and second electrode conductive plates.

10. A structure including said apparatus of claim 1 further comprising a motor and a motor face plate connected to said motor, wherein said apparatus is disposed between said motor and said motor face plate.

11. The structure of claim 10 further comprising a circuit;

wherein said first electrode conductive plate is coupled to a first conductor of said circuit;

wherein the second electrode conductive plate is coupled to a second conductor of said circuit.

12. A method of using an apparatus, said apparatus comprising a first ground conductive plate, a second ground conductive plate, a third ground conductive plate, a first electrode conductive plate, a second electrode conductive plate, wherein said first electrode conductive plate is disposed between said first ground conductive plate and said second ground conductive plate, wherein said second electrode conductive plate is disposed between said second ground conductive plate and said third ground conductive plate, wherein said first ground conductive plate, said second ground conductive plate, and said third ground conductive plate are conductively interconnected, and wherein said first electrode conductive plate is shielded from said second electrode conductive plate by the ground conductive plates, said method comprising:

connecting said first electrode conductive plate and said second electrode conductive plate into an electrical circuit.

13. The method of claim 12, further comprising energizing said circuit.

14. The method of claim 12 wherein said apparatus is mounted on a motor.

15. The method of claim 12 wherein the first, second, and third ground conductive plates are conductively coupled to a conductive portion of a housing of a motor.

16. A method of making an structure comprising:

providing an apparatus comprising;

providing a first ground conductive plate;

providing a second ground conductive plate;

providing a third ground conductive plate;

providing a first electrode conductive plate;

providing a second electrode conductive plate;

disposing said first electrode conductive plate between said first ground conductive plate and said second ground conductive plate;

disposing said second electrode conductive plate between said second ground conductive plate and said third ground conductive plate;

interconnecting conductively said first ground conductive plate, said second ground conductive plate, and said third ground conductive plate; and

wherein said first electrode conductive plate is shielded from said second electrode conductive plate by the ground conductive plates.

17. The method of claim 16, wherein providing said apparatus further comprises:

providing an electrically non-conductive material; and

disposing said electrically non-conductive material between at least one of (1) said first ground conductive plate and said second ground conductive plate and (2) said second ground conductive plate and said third ground conductive plate.

18. The method of claim 16 further comprising mounting said apparatus on a motor housing.

19. The method of claim 18 wherein said mounting further comprises placing a shaft of a motor through an aperture in said apparatus.

20. The method of claim 16 further comprising disposing said apparatus between a motor and a motor face plate.