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High frequency module

  • US 6,873,529 B2
  • Filed: 02/21/2003
  • Issued: 03/29/2005
  • Est. Priority Date: 02/26/2002
  • Status: Expired due to Fees
First Claim
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1. A high frequency module comprising:

  • a dielectric substrate comprising a plurality of dielectric layers that are laminated together;

    a power amplifier device mounted on a power amplifier device mounting portion that is formed on a first surface of the dielectric substrate;

    a filter component mounted on a filter component mounting portion formed on the first surface of the dielectric substrate;

    a first through-hole conductor which is formed under the power amplifier device mounting portion and penetrates through the dielectric substrate to a second surface thereof; and

    a second through-hole conductor whose one end is exposed at the second surface of the dielectric substrate and which is provided between the power amplifier device mounting portion and the filter component mounting portion;

    wherein the first through-hole conductor and the second through-hole conductor are connected to a thermal dissipation conductor on an upper surface of an external electric circuit board through a brazing material.

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