Method and system for fabrication of integrated tunable/switchable passive microwave and millimeter wave modules

• US 6,876,056 B2
• Filed: 04/18/2002
• Issued: 04/05/2005
• Est. Priority Date: 04/19/2001
• Status: Expired due to Term

• Current Assignee: Interuniversitair Micro-Electronica Centrum VZW (IMEC International)
• Original Assignee: Interuniversitair Micro-Electronica Centrum VZW (IMEC International)
• Inventors: Beyne, Eric, Tilmans, Hendrikus, De Raedt, Walter, Jansen, Henri
• Primary Examiner(s): Thomas, Tom
• Assistant Examiner(s): Fenty, Jesse A.
• Application Number:
  US10/127,341
• Publication Number:
  US 20030042567A1
• Time in Patent Office: 1,083 Days
• Field of Search: 257528-532, 257/312
• US Class Current: 257/528
• CPC Class Codes: B81B 7/0006 Interconnects
• CPC Class Codes: H01H 59/0009 making use of micromechanics
• CPC Class Codes: H01L 21/84 the substrate being other than a semiconductor body, e.g. being an insulating body
• CPC Class Codes: H01L 27/12 the substrate being other than a semiconductor body, e.g. an insulating body
• CPC Class Codes: H01P 1/127 Strip line switches

Abstract

An interconnect module and a method of manufacturing the same is described comprising: a substrate, an interconnect section formed on the substrate, and a variable passive device section formed on the substrate located laterally adjacent to the interconnect section. The interconnect section has at least two metal interconnect layers separated by a dielectric layer and the variable passive device has at least one moveable element. The moveable element is formed from a metal layer which is formed from the same material and at the same time as one of the two interconnect layers. The moveable element is formed on the dielectric layer and is released by local removal of the dielectric layer. Additional interconnect layers and intermediate dielectric layers may be added.

Claims

1. An interconnect module comprising:

a substrate;

an interconnect section formed on the substrate; and

a passive device section formed on the substrate located laterally adjacent to the interconnect section, the interconnect section having at least two metal interconnect layers separated by a dielectric layer and the variable passive device having at least one moveable element, wherein the moveable element is formed from a metal layer which is formed from the same material as one of the two interconnect layers, and wherein the interconnect section comprises a first interconnect metal layer, an intermediate dielectric layer formed on the first interconnect metal layer and a second interconnect metal layer formed on the intermediate dielectric layer, the moveable element being formed from the same material as the second interconnect metal layer.

2. An interconnect module comprising:

a substrate;

an interconnect section formed on the substrate; and

a passive device section formed on the substrate located laterally adjacent to the interconnect section, the interconnect section having at least two metal interconnect layers separated by a dielectric layer and the variable passive device having at least one moveable element, wherein the moveable element is formed from a metal layer which is formed from the same material as one of the two interconnect layers, and wherein the interconnect section comprises a first interconnect metal layer, a first intermediate dielectric layer formed on the first interconnect metal layer, a second interconnect metal layer formed on the first intermediate dielectric layer, a second intermediate dielectric layer formed on the second interconnect metal layer, and a third interconnect metal layer formed on the second intermediate dielectric layer, the moveable element being formed from the same material as the second interconnect metal layer.

3. An interconnect module comprising:

a substrate;

an interconnect section formed on the substrate; and

a passive device section formed on the substrate located laterally adjacent to the interconnect section, the interconnect section having at least two metal interconnect layers separated by a dielectric layer and the variable passive device having at least one moveable element, wherein the moveable element is formed from a metal layer which is formed from the same material as one of the two interconnect layers, and wherein the interconnect section comprises a first interconnect metal layer, a first intermediate dielectric layer formed on the first interconnect metal layer, a second interconnect metal layer formed on the first intermediate dielectric layer, a second intermediate dielectric layer formed on the second interconnect metal layer, and a third interconnect metal layer formed on the second intermediate dielectric layer, the moveable element being formed from the same material as the third interconnect metal layer.

4. An interconnect module comprising:

a substrate;

an interconnect section formed on the substrate, the interconnect section comprising fixed passive devices; and

a passive device section formed on the substrate located laterally adjacent to the interconnect section, the interconnect section having at least two metal interconnect layers separated by a dielectric layer and the variable passive device having at least one moveable element, wherein the fixed passive devices are connected to each other by at least one of the interconnect metal layers.