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Methods and structures for electronic probing arrays

  • US 6,876,212 B2
  • Filed: 12/04/2003
  • Issued: 04/05/2005
  • Est. Priority Date: 07/07/1994
  • Status: Expired due to Fees
First Claim
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1. A probe card for testing electronic elements comprising:

  • (a) a substrate having an electrical circuitry thereon;

    (b) an encapsulant layer overlying said substrate; and

    (c) a plurality of flexible leads extending through said encapsulant layer, said plurality of flexible leads being permanently bonded to said electrical circuitry, said plurality of flexible leads having terminals projecting above said encapsulant layer and exposed for engagement with contact pads on a electronic element, said plurality of flexible leads having flexible portions disposed within said encapsulant layer.

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