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MEMS device having contact and standoff bumps and related methods

  • US 6,876,482 B2
  • Filed: 11/08/2002
  • Issued: 04/05/2005
  • Est. Priority Date: 11/09/2001
  • Status: Expired due to Term
First Claim
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1. A movable, MEMS component suspended over a substrate, the component comprising:

  • (a) a structural layer having a movable electrode separated from the substrate by a gap; and

    (b) at least one standoff bump attached to the structural layer and protruding through the movable electrode and extending into the gap for preventing contact of the movable electrode with a conductive material on the substrate when the component moves.

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