Deformable segmented MEMS mirror

• US 6,876,484 B2
• Filed: 03/24/2003
• Issued: 04/05/2005
• Est. Priority Date: 03/24/2003
• Status: Expired due to Term

• Current Assignee: Lucent Technologies, Inc. (Nokia Corporation)
• Original Assignee: Lucent Technologies, Inc. (Nokia Corporation)
• Inventors: Greywall, Dennis S.
• Primary Examiner(s): Dang, Hung Xuen
• Assistant Examiner(s): TRA, TUYEN Q
• Application Number:
  US10/395,362
• Publication Number:
  US 20040190110A1
• Time in Patent Office: 743 Days
• Field of Search: 359/291, 359/290, 359/292, 359/223, 359/274, 359/230, 359/320, 359/850, 359/224
• US Class Current: 359/291
• CPC Class Codes: G02B 26/06 for controlling the phase of light G02B26/08 takes precedence , measuring optical phase difference G01J9/00

Abstract

A MEMS device having a deformable segmented mirror. The mirror includes a plurality of movable segments supported on a substrate using spring vertices, each vertex having a fixed plate and one or more springs. In a representative embodiment, three springs support each movable segment, where each spring connects the movable segment to a different spring vertex. The MEMS device also has a plurality of electrodes, each of which can be individually biased. A movable segment moves in response to a voltage applied to an electrode located beneath that segment while the deformed springs attached to the segment provide a restoring force. Due to the fixed plates, motion of each movable segment is substantially decoupled from that of the adjacent segments, which makes the shape of the segmented mirror relatively easy to control. In addition, segments in a deformable mirror of the invention can be displaced by a distance that is significantly larger than the maximum deformation amplitude for a membrane mirror of the prior art. The MEMS device can be fabricated using two silicon-on-insulator (SOI) wafers and an etch fabrication technique.

Claims

1. A MEMS device, comprising a plurality of movable segments, each segment supported by springs and positioned offset from a substrate by an offset distance, wherein:

each spring is attached between a corresponding stationary structure and a corresponding movable segment, said stationary structure fixed with respect to the substrate;

each movable segment is adapted to move with respect to the substrate to change the offset distance;

at least one movable segment has a hexagonal shape; and

exactly three springs are attached to the at least one movable segment such that each of the three said springs is attached to a different stationary structure.

2. The device of claim 1, wherein the stationary structure rests upon a post supporting said stationary structure on the substrate.

3. The device of claim 1, wherein:

for each movable segment, the device includes a first electrode;

each movable segment is adapted to translate in response to a first voltage applied between the corresponding first electrode and the movable segment, wherein the translation changes the offset distance.

4. The device of claim 3, wherein:

for at least one movable segment, the device includes a second electrode;

the at least one movable segment is adapted to translate and rotate in response to one or more voltages applied between one or more of the first and second electrodes and the at least one movable segment.

5. The device of claim 1, wherein:

the plurality of movable segments and the springs are formed using a first wafer; and

a second wafer comprises the substrate.

6. The device of claim 1, wherein:

the plurality of movable segments are arranged in a substantially contiguous pattern; and

each movable segment has a reflective coating to form a deformable mirror over the contiguous pattern, wherein each movable segment is adapted to move substantially independent of every other movable segment.

7. The device of claim 1, wherein the at least one movable segment is adapted to tilt in any selected direction with respect to a plane defined by said segment at a rest position.

8. The device of claim 7, wherein:

for the at least one movable segment, the device includes at least three electrodes; and

the tilt direction is selected by application of one or more voltages between one or more of the at least three electrodes and the at least one movable segment.

9. A method of fabricating a MEMS device, comprising:

forming a plurality of movable segments, each segment supported by springs and positioned offset from a substrate by an offset distance, wherein;

each spring is attached between a corresponding stationary structure fixedly supported on the substrate and a corresponding movable segment; and

each movable segment is adapted to move with respect to the substrate to change the offset distance;

for each stationary structure, forming a post, wherein;

the stationary structure is rigidly attached to the post and the past is designed to support said stationary structure on the substrate;

the plurality of segments, the springs, and the posts are formed using a first wafer; and

a second wafer comprises the substrate;

forming an open grid structure adjacent to the plurality of segments and the springs using the first wafer;

transferring pressure via the open grid structure to the termini of the posts to bond the first and second wafers; and

removing the open grid structure from the first wafer.

10. The method of claim 9, wherein:

the first wafer comprises three or more layers; and

the plurality of segments and the springs are formed using a single layer of the first wafer.

11. The method of claim 9, wherein at least one of the first and second wafers is a silicon-on-insulator wafer.

12. A method of fabricating a MEMS device, comprising:

forming a plurality of segments, a plurality of spring vertices, a plurality of posts, and a grid structure using a first wafer, wherein the grid structure is adjacent to the pluralities of segments and spring vertices;

bonding the first wafer together with a second wafer using the grid structure; and

removing the grid structure to release the pluralities of segments and spring vertices.

13. The method of claim 12, wherein bonding the first wafer together with the second wafer comprises transferring pressure via the grid structure to the termini of the posts to bond the first and second wafers together.

14. The method of claim 12, further comprising, for each segment, forming a corresponding electrode using the second wafer.

15. A MEMS device, comprising a plurality of movable segments, each segment supported by springs and positioned offset from a substrate, wherein:

each spring is attached between a corresponding stationary structure and a corresponding movable segment, said stationary structure fixed with respect to the substrate;

each movable segment has an outer surface and is adapted to move with respect to the substrate substantially along a normal to the outer surface;

at least one movable segment has a hexagonal shape; and

exactly three springs are attached to the at least one movable segment such that each of the three springs is attached to a different stationary structure.

16. The device of claim 15, wherein the stationary structure rests upon a post supporting said stationary structure on the substrate.

17. The device of claim 15, wherein:

for each movable segment, the device includes a first electrode;

each movable segment is adapted to translate in response to a first voltage applied between the corresponding first electrode and the movable segment, wherein the translation changes the offset distance.

18. The device of claim 17, wherein:

for at least one movable segment, the device includes a second electrode;

the at least one movable segment is adapted to translate and rotate in response to one or more voltages applied between one or more of the first and second electrodes and the at least one movable segment.

19. The device of claim 15, wherein:

the plurality of movable segments and the springs are formed using a first wafer; and

a second wafer comprises the substrate.

20. The device of claim 15, wherein:

the plurality of movable segments are arranged in a substantially contiguous pattern; and

each movable segment has a reflective coating to form a deformable mirror over the contiguous pattern, wherein each movable segment is adapted to move substantially independent of every other movable segment.

21. The device of claim 15, wherein the at least one movable segment is adapted to tilt in any selected direction with respect to a plane defined by said segment at a rest position.

22. The device of claim 21, wherein:

for the at least one movable segment, the device includes at least three electrodes; and

the tilt direction is selected by application of one or more voltages between one or more of the at least three electrodes and the at least one movable segment.