×

Printing wiring board and method of producing the same and capacitor to be contained in printed wiring board

  • US 6,876,554 B1
  • Filed: 09/01/2000
  • Issued: 04/05/2005
  • Est. Priority Date: 09/02/1999
  • Status: Expired due to Fees
First Claim
Patent Images

1. A printed circuit board arrangement comprising:

  • a core substrate having a cavity therein, and a resin insulating layer and a conductor circuit laminated on the core substrate, and a plurality of capacitors accommodated in the cavity, wherein at least a part of electrodes of each capacitor is uncoated with a coating layer and exposed to the outside, and an electric connection for the electrode exposed from the coating layer is established by plating.

View all claims
  • 1 Assignment
Timeline View
Assignment View
    ×
    ×