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Lid assembly for a processing system to facilitate sequential deposition techniques

  • US 6,878,206 B2
  • Filed: 12/12/2001
  • Issued: 04/12/2005
  • Est. Priority Date: 07/16/2001
  • Status: Expired due to Term
First Claim
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1. A lid assembly for a semiconductor processing system, the lid assembly comprising:

  • a lid having first and second opposed surfaces;

    a plurality of controllable flow channels extending from the first and second opposed surfaces; and

    a gas control system disposed on the first surface and operably opening and closing the channels, wherein the gas control system comprises;

    a gas manifold disposed on the lid;

    at least one valve coupled to the gas manifold and adapted to control a flow through one of the flow channels; and

    a reservoir positioned on the lid and fluidly connected to the gas manifold.

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